Ng, S. L. (2016). Bondability and reliability study on various silver plated copper leadframe with 25um wire diameter of gold and copper wire.
Chicagoスタイル(17版)引用形式Ng, Shay Lee. Bondability and Reliability Study on Various Silver Plated Copper Leadframe with 25um Wire Diameter of Gold and Copper Wire. 2016.
MLA(9版)引用形式Ng, Shay Lee. Bondability and Reliability Study on Various Silver Plated Copper Leadframe with 25um Wire Diameter of Gold and Copper Wire. 2016.
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