Bondability and reliability study on various silver plated copper leadframe with 25um wire diameter of gold and copper wire

Silver spot plated copper leadframe play very importance role in semiconductor industry.Throughout the semiconductor industry intense economic competition has stimulated interest in the area of package cost reduction per year function over the range of products it offers.In an attempt to meet the de...

詳細記述

書誌詳細

第一著者:	Ng, Shay Lee
フォーマット:	学位論文
言語:	英語 英語
出版事項:	2016
主題:	T Technology (General) TS Manufactures
オンライン･アクセス:	http://eprints.utem.edu.my/id/eprint/20566/1/Bondability%20and%20reliability%20study%20on%20various%20silver%20plated%20copper%20leadframe%20with%2025um%20wire%20diameter%20of%20gold%20and%20copper%20wire.pdf http://eprints.utem.edu.my/id/eprint/20566/2/Bondability%20and%20reliability%20study%20on%20various%20silver%20plated%20copper%20leadframe%20with%2025um%20wire%20diameter%20of%20gold%20and%20copper%20wire.pdf