APA引文

Mohd Tahir, M. H. H. (2016). Improvement of mold ability and wire sweep in semiconductor devices using DOE statistical approach.

Chicago Style (17th ed.) Citation

Mohd Tahir, Mohd Hirzarul Hafiz. Improvement of Mold Ability and Wire Sweep in Semiconductor Devices Using DOE Statistical Approach. 2016.

MLA引文

Mohd Tahir, Mohd Hirzarul Hafiz. Improvement of Mold Ability and Wire Sweep in Semiconductor Devices Using DOE Statistical Approach. 2016.

警告：這些引文格式不一定是100％准確.