Improvement of mold ability and wire sweep in semiconductor devices using DOE statistical approach

Molding, also known as encapsulation in semiconductor industry, is one of the main processes in semiconductor manufacturing. In semiconductor industry, encapsulation is usually done using transfer molding due to very high accuracy of transfer molding tooling and low cycle time of the molding proces...

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Bibliographic Details

Main Author:	Mohd Tahir, Mohd Hirzarul Hafiz
Format:	Thesis
Language:	English English
Published:	2016
Subjects:	T Technology (General) TP Chemical technology
Online Access:	http://eprints.utem.edu.my/id/eprint/21111/1/Improvement%20Of%20Mold%20Ability%20And%20Wire%20Sweep%20In%20Semiconductor%20Devices%20Using%20DOE%20Statistical%20Approach.pdf http://eprints.utem.edu.my/id/eprint/21111/2/Improvement%20of%20mold%20ability%20and%20wire%20sweep%20in%20semiconductor%20devices%20using%20DOE%20statistical%20approach.pdf