Improvement of mold ability and wire sweep in semiconductor devices using DOE statistical approach

Molding, also known as encapsulation in semiconductor industry, is one of the main processes in semiconductor manufacturing. In semiconductor industry, encapsulation is usually done using transfer molding due to very high accuracy of transfer molding tooling and low cycle time of the molding proces...

詳細記述

書誌詳細

第一著者:	Mohd Tahir, Mohd Hirzarul Hafiz
フォーマット:	学位論文
言語:	英語 英語
出版事項:	2016
主題:	T Technology (General) TP Chemical technology
オンライン･アクセス:	http://eprints.utem.edu.my/id/eprint/21111/1/Improvement%20Of%20Mold%20Ability%20And%20Wire%20Sweep%20In%20Semiconductor%20Devices%20Using%20DOE%20Statistical%20Approach.pdf http://eprints.utem.edu.my/id/eprint/21111/2/Improvement%20of%20mold%20ability%20and%20wire%20sweep%20in%20semiconductor%20devices%20using%20DOE%20statistical%20approach.pdf