Improvement of mold ability and wire sweep in semiconductor devices using DOE statistical approach

Molding, also known as encapsulation in semiconductor industry, is one of the main processes in semiconductor manufacturing. In semiconductor industry, encapsulation is usually done using transfer molding due to very high accuracy of transfer molding tooling and low cycle time of the molding proces...

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主要作者:	Mohd Tahir, Mohd Hirzarul Hafiz
格式:	Thesis
语言:	英语 英语
出版:	2016
主题:	T Technology (General) TP Chemical technology
在线阅读:	http://eprints.utem.edu.my/id/eprint/21111/1/Improvement%20Of%20Mold%20Ability%20And%20Wire%20Sweep%20In%20Semiconductor%20Devices%20Using%20DOE%20Statistical%20Approach.pdf http://eprints.utem.edu.my/id/eprint/21111/2/Improvement%20of%20mold%20ability%20and%20wire%20sweep%20in%20semiconductor%20devices%20using%20DOE%20statistical%20approach.pdf