APA(7版)引用形式

Zainul Hashimi, F. (2019). Reducing Void During Transfer Moulding Of Semiconductor Plastic Package Using.

Chicagoスタイル(17版)引用形式

Zainul Hashimi, Faridah. Reducing Void During Transfer Moulding Of Semiconductor Plastic Package Using. 2019.

MLA(9版)引用形式

Zainul Hashimi, Faridah. Reducing Void During Transfer Moulding Of Semiconductor Plastic Package Using. 2019.

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