APA (7th ed.) Citation

Zainul Hashimi, F. (2019). Reducing Void During Transfer Moulding Of Semiconductor Plastic Package Using.

Chicago Style (17th ed.) Citation

Zainul Hashimi, Faridah. Reducing Void During Transfer Moulding Of Semiconductor Plastic Package Using. 2019.

MLA (9th ed.) Citation

Zainul Hashimi, Faridah. Reducing Void During Transfer Moulding Of Semiconductor Plastic Package Using. 2019.

Warning: These citations may not always be 100% accurate.