APA引文

Zainul Hashimi, F. (2019). Reducing Void During Transfer Moulding Of Semiconductor Plastic Package Using.

Chicago Style (17th ed.) Citation

Zainul Hashimi, Faridah. Reducing Void During Transfer Moulding Of Semiconductor Plastic Package Using. 2019.

MLA引文

Zainul Hashimi, Faridah. Reducing Void During Transfer Moulding Of Semiconductor Plastic Package Using. 2019.

警告：這些引文格式不一定是100％准確.