Reducing Void During Transfer Moulding Of Semiconductor Plastic Package Using

Transfer moulding is a process that generally used at an assembly area in the electronics industry, specifically in the semiconductor plastic packaging industry. This is because the transfer moulding uses an Epoxy Moulding Compound (EMC) material to encapsulate the chip and wire bond that attached t...

पूर्ण विवरण

ग्रंथसूची विवरण
मुख्य लेखक:	Zainul Hashimi, Faridah
स्वरूप:	थीसिस
भाषा:	अंग्रेज़ी अंग्रेज़ी
प्रकाशित:	2019
विषय:	T Technology (General) TP Chemical technology
ऑनलाइन पहुंच:	http://eprints.utem.edu.my/id/eprint/24952/1/Reducing%20Void%20During%20Transfer%20Moulding%20Of%20Semiconductor%20Plastic%20Package%20Using.pdf http://eprints.utem.edu.my/id/eprint/24952/2/Reducing%20Void%20During%20Transfer%20Moulding%20Of%20Semiconductor%20Plastic%20Package%20Using.pdf

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