Reducing Void During Transfer Moulding Of Semiconductor Plastic Package Using

Transfer moulding is a process that generally used at an assembly area in the electronics industry, specifically in the semiconductor plastic packaging industry. This is because the transfer moulding uses an Epoxy Moulding Compound (EMC) material to encapsulate the chip and wire bond that attached t...

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Bibliographic Details
Main Author:	Zainul Hashimi, Faridah
Format:	Thesis
Language:	English English
Published:	2019
Subjects:	T Technology (General) TP Chemical technology
Online Access:	http://eprints.utem.edu.my/id/eprint/24952/1/Reducing%20Void%20During%20Transfer%20Moulding%20Of%20Semiconductor%20Plastic%20Package%20Using.pdf http://eprints.utem.edu.my/id/eprint/24952/2/Reducing%20Void%20During%20Transfer%20Moulding%20Of%20Semiconductor%20Plastic%20Package%20Using.pdf

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