Reducing Void During Transfer Moulding Of Semiconductor Plastic Package Using

Transfer moulding is a process that generally used at an assembly area in the electronics industry, specifically in the semiconductor plastic packaging industry. This is because the transfer moulding uses an Epoxy Moulding Compound (EMC) material to encapsulate the chip and wire bond that attached t...

書誌詳細
第一著者:	Zainul Hashimi, Faridah
フォーマット:	学位論文
言語:	英語英語
出版事項:	2019
主題:	T Technology (General) TP Chemical technology
オンライン･アクセス:	http://eprints.utem.edu.my/id/eprint/24952/1/Reducing%20Void%20During%20Transfer%20Moulding%20Of%20Semiconductor%20Plastic%20Package%20Using.pdf http://eprints.utem.edu.my/id/eprint/24952/2/Reducing%20Void%20During%20Transfer%20Moulding%20Of%20Semiconductor%20Plastic%20Package%20Using.pdf

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