APA(7版)引用形式

Jamaluddin, N. (2020). Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application.

Chicagoスタイル(17版)引用形式

Jamaluddin, Nurezzaty. Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application. 2020.

MLA(9版)引用形式

Jamaluddin, Nurezzaty. Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application. 2020.

警告: この引用は必ずしも正確ではありません.