APA (7 वां संस्करण) प्रशस्ति पत्र

Jamaluddin, N. (2020). Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application.

शिकागो शैली (17वां संस्करण) प्रशस्ति पत्र

Jamaluddin, Nurezzaty. Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application. 2020.

एमएलए (9वां संस्करण) प्रशस्ति पत्र

Jamaluddin, Nurezzaty. Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application. 2020.

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