Ahmad, I. F. (2022). The analysis on functionality of composite solder oxidize copper lead frame interconnect in microelectronic packaging.
芝加哥风格引文Ahmad, Intan Fatihah. The Analysis on Functionality of Composite Solder Oxidize Copper Lead Frame Interconnect in Microelectronic Packaging. 2022.
MLA引文Ahmad, Intan Fatihah. The Analysis on Functionality of Composite Solder Oxidize Copper Lead Frame Interconnect in Microelectronic Packaging. 2022.
警告：这些引文格式不一定是100％准确.