The analysis on functionality of composite solder oxidize copper lead frame interconnect in microelectronic packaging

Recently, the attention toward CNT-composite solder (CCS) has increased remarkably due to numerous advantages. However, the electronic devices’ failure is still growing and has become an integral part of the countless product in the industrial market. These failures are mainly related to the reliabi...

Description complète

Détails bibliographiques
Auteur principal:	Ahmad, Intan Fatihah
Format:	Thèse
Langue:	anglais anglais
Publié:	2022
Sujets:	T Technology (General) TK Electrical engineering. Electronics Nuclear engineering
Accès en ligne:	http://eprints.utem.edu.my/id/eprint/26873/1/The%20analysis%20on%20functionality%20of%20composite%20solder%20oxidize%20copper%20lead%20frame%20interconnect%20in%20microelectronic%20packaging.pdf http://eprints.utem.edu.my/id/eprint/26873/2/The%20analysis%20on%20functionality%20of%20composite%20solder%20oxidize%20copper%20lead%20frame%20interconnect%20in%20microelectronic%20packaging.pdf

Documents similaires

Classical and damage mechanics-based models for lead-free solder interconnects
par: Lai, Zheng Bo
Publié: (2009)

Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model
par: Mohd. Yamin, Aliff Farhan
Publié: (2012)

Temperature and strain-rate dependent damage-based models for lead-free solder interconnects
par: Mad Asasaari, Siti Faizah
Publié: (2021)

Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
par: Hashim, Md. Amin
Publié: (2011)

Warpage Behavior Of Thin Fcbga Package And Prediction Of Its First Interconnect Snag Solder Joint Shape
par: Lim, Shaw Fa
Publié: (2020)

Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
par: Binh, Duong Ngoc
Publié: (2009)

Interfacial microstructure growth mechanism of lead-free solder using laser soldering
par: Muhammad Asyraf, Abdullah
Publié: (2024)

Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application
par: Bakir, Mohammed Luay
Publié: (2012)

Modeling Of Vertical Side Chip Interconnect Technology For 3-Dimensional Packaging
par: Tan , Ai Heong
Publié: (2015)

Minimization of copper dissolution for lead-free wave soldering in surface mount technology
par: Arunasalam, Mageswaran
Publié: (2017)

Effect of isothermal aging on the corrosion behavior of tin-lead and lead-free solders
par: Asri, Asma Kamarul
Publié: (2011)

Solder Joint Reliability Of Flip Chip BGA Package
par: Lee, Kor Oon
Publié: (2004)

Interfacial reactions between lead-free solders and electroless nickel
par: Mohd. Muzamir Mahat
Publié: (2009)

Numerical And Experimental Analyses Of Piezoelectric Fans For Microelectronics Cooling
par: Ramana, Maram Venkata
Publié: (2010)

Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders
par: Wahab, Abdul Karim Abdul
Publié: (2011)

Study of interfacial reactions between lead-free solders and immersion silver finish
par: Oshaghi, Safoura
Publié: (2008)

Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes
par: Abu Hassan, Nurfazlin
Publié: (2009)

Study on intermetallic compound formation and growth at the solder joint interface during laser soldering using sn-ag-cu powdered compact solder on copper pad
par: Nabila, Tamar Jaya
Publié: (2024)

Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process
par: Chellvarajoo, Srivalli
Publié: (2016)

Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process
par: Chellvarajoo, Srivalli
Publié: (2016)

Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
par: Idris, Siti Rabiatull Aisha
Publié: (2008)

Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish
par: Boo, Nan Shing
Publié: (2010)

Interconnect delay and routing in nanometer VLSI
par: Kuay, Chong Lee
Publié: (2008)

Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].
par: Goh, Teck Joo
Publié: (2004)

Bismuth-antimony as an alternative material for high temperature lead-free solder
par: Muhamad Zam, Shahrul Fadzli
Publié: (2012)

Bismuth-argentum alloys as alternative high temperature lead-free solder
par: Rosilli, Rohaizuan
Publié: (2012)

Analysis and performance evaluation of a fault-tolerant multistage interconnection network
par: Hui, Seng Kheong
Publié: (2003)

Intermetallics evolution and shear strength of carbon nanotubes- reinforced sn-5sb solder on copper board
par: Dele-Afolabi, Temitope Theophilus
Publié: (2015)

Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish
par: Osman, Saliza Azlina
Publié: (2008)

Hierarchical voltage control strategy in interconnected power systems
par: Zainal Abidin, Mohd. Fhirdaus
Publié: (2013)

Substrate warpage analysis during solder reflow process
par: Beh , Keh Shin
Publié: (2004)

Interconnection and damping assignment passivity based controller for multilevel inverter
par: Nur Huda, Ramlan
Publié: (2017)

Interconnection and damping assignment passivity-based controller for multilevel inverter
par: Ramlan, Nur Huda
Publié: (2017)

Morphological and mechanical characterisation of BI-AG alloy as high temperature lead free solder
par: Nahavandi, Mahdi
Publié: (2014)

Development of dynamic equivalents for interconnected power systems using identification approaches
par: Kok, Boon Ching
Publié: (2009)

Numerical analysis of tubercles leading edge for unmanned aerial vehicle composite wing
par: Basri, Ernnie Illyani
Publié: (2020)

The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating
par: Maliessa Nabilah, Mazelan
Publié: (2023)

Silicon Photonics Devices Based On Microring Resonator For Optical Interconnect System
par: Abd Aziz, Nurul Nadia
Publié: (2017)

Optimization of routing algorithm for interconnect delay in ultra large scale interation designs
par: Husin, Nasir Shaikh
Publié: (2008)

Interconnect tree optimization algorithm in nanometer very large scale integration designs
par: Eh Kan, Chessda Uttraphan
Publié: (2016)