The analysis on functionality of composite solder oxidize copper lead frame interconnect in microelectronic packaging

Recently, the attention toward CNT-composite solder (CCS) has increased remarkably due to numerous advantages. However, the electronic devices’ failure is still growing and has become an integral part of the countless product in the industrial market. These failures are mainly related to the reliabi...

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主要作者:	Ahmad, Intan Fatihah
格式:	Thesis
语言:	英语 英语
出版:	2022
主题:	T Technology (General) TK Electrical engineering. Electronics Nuclear engineering
在线阅读:	http://eprints.utem.edu.my/id/eprint/26873/1/The%20analysis%20on%20functionality%20of%20composite%20solder%20oxidize%20copper%20lead%20frame%20interconnect%20in%20microelectronic%20packaging.pdf http://eprints.utem.edu.my/id/eprint/26873/2/The%20analysis%20on%20functionality%20of%20composite%20solder%20oxidize%20copper%20lead%20frame%20interconnect%20in%20microelectronic%20packaging.pdf