Microstructural characterization of pressureless sintered silver die attached material

Sintered silver (Ag) is one of the most promising interconnect materials for high power electronics applications due to its ability to withstand high temperature exceeding 250 °C while in operation.In this thesis, themicrostructural evolutions of spherical and flake types pressureless sintered Ag di...

詳細記述

書誌詳細

第一著者:	Esa, Siti Rahmah
フォーマット:	学位論文
言語:	英語 英語
出版事項:	2022
主題:	T Technology (General) TN Mining engineering. Metallurgy
オンライン･アクセス:	http://eprints.utem.edu.my/id/eprint/26950/1/Microstructural%20characterization%20of%20pressureless%20sintered%20silver%20die%20attached%20material.pdf http://eprints.utem.edu.my/id/eprint/26950/2/Microstructural%20characterization%20of%20pressureless%20sintered%20silver%20die%20attached%20material.pdf