Microstructural characterization of pressureless sintered silver die attached material

Sintered silver (Ag) is one of the most promising interconnect materials for high power electronics applications due to its ability to withstand high temperature exceeding 250 °C while in operation.In this thesis, themicrostructural evolutions of spherical and flake types pressureless sintered Ag di...

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主要作者:	Esa, Siti Rahmah
格式:	Thesis
语言:	英语 英语
出版:	2022
主题:	T Technology (General) TN Mining engineering. Metallurgy
在线阅读:	http://eprints.utem.edu.my/id/eprint/26950/1/Microstructural%20characterization%20of%20pressureless%20sintered%20silver%20die%20attached%20material.pdf http://eprints.utem.edu.my/id/eprint/26950/2/Microstructural%20characterization%20of%20pressureless%20sintered%20silver%20die%20attached%20material.pdf