Wong, J. Y. (2021). Copper wire bond improvement on aluminum interface for optimum high emperature storage reliability performance.
शिकागो शैली (17वां संस्करण) प्रशस्ति पत्रWong, Jia Yi. Copper Wire Bond Improvement on Aluminum Interface for Optimum High Emperature Storage Reliability Performance. 2021.
एमएलए (9वां संस्करण) प्रशस्ति पत्रWong, Jia Yi. Copper Wire Bond Improvement on Aluminum Interface for Optimum High Emperature Storage Reliability Performance. 2021.
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