Thermosonic micro-interconnections: Interfacial Cu-Al intermetallics compound growth studies based on stress modelling
One of the most common wire bonding technology involving copper (Cu) wire interconnections is the thermosonic bonding technique. Still, the volumetric changes of intermetallic compounds (IMCs) formed at the bonding interface of Cu wire on Al bond pads induce voids formation in the Cu-Al IMC layer. T...
| मुख्य लेखक: | |
|---|---|
| स्वरूप: | थीसिस |
| भाषा: | अंग्रेज़ी अंग्रेज़ी |
| प्रकाशित: |
2024
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| ऑनलाइन पहुंच: | http://eprints.utem.edu.my/id/eprint/28287/1/Thermosonic%20micro-interconnections-%20Interfacial%20Cu-Al%20intermetallics%20compound%20growth%20studies%20based%20on%20stress%20modelling.pdf http://eprints.utem.edu.my/id/eprint/28287/2/Thermosonic%20micro-interconnections-%20Interfacial%20Cu-Al%20intermetallics%20compound%20growth%20studies%20based%20on%20stress%20modelling.pdf |
इंटरनेट
http://eprints.utem.edu.my/id/eprint/28287/1/Thermosonic%20micro-interconnections-%20Interfacial%20Cu-Al%20intermetallics%20compound%20growth%20studies%20based%20on%20stress%20modelling.pdfhttp://eprints.utem.edu.my/id/eprint/28287/2/Thermosonic%20micro-interconnections-%20Interfacial%20Cu-Al%20intermetallics%20compound%20growth%20studies%20based%20on%20stress%20modelling.pdf