APA (7th ed.) Citation

Siti Mariam, M. (2024). Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly.

Chicago Style (17th ed.) Citation

Siti Mariam, Man. Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly. 2024.

MLA (9th ed.) Citation

Siti Mariam, Man. Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly. 2024.

Warning: These citations may not always be 100% accurate.