Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly
In the rapid growth of the semiconductor industry, subcontractors are highly competitive to gain their market segment and sustain the business. The ability to meet the shipment commits is critical, often gated by the process cycle time. Increasing challenges arise with high product customization in...
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| フォーマット: | 学位論文 |
| 言語: | 英語 英語 英語 |
| 出版事項: |
2024
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| オンライン･アクセス: | https://etd.uum.edu.my/10989/1/depositpermission-s900375.pdf https://etd.uum.edu.my/10989/2/s900375_01.pdf https://etd.uum.edu.my/10989/3/s900375_02.pdf https://etd.uum.edu.my/10989/ |
| Abstract | Abstract here |
| _version_ | 1855575003649540096 |
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| author | Siti Mariam, Man |
| author_facet | Siti Mariam, Man |
| author_sort | Siti Mariam, Man |
| description | In the rapid growth of the semiconductor industry, subcontractors are highly competitive to gain their market segment and sustain the business. The ability to meet the shipment commits is critical, often gated by the process cycle time. Increasing challenges arise with high product customization in a make-to-order (MTO) environment. Such a company is Carsem (M) Sdn. Bhd. which had faced the issues of long cycle time resulting in shipment de-commits, and profit loss. The manual planning procedure could not cater to the demands of a quick turnaround for complex products |
| format | Thesis |
| id | oai:etd.uum.edu.my:10989 |
| institution | Universiti Utara Malaysia |
| language | English English English |
| publishDate | 2024 |
| record_format | EPrints |
| record_pdf | Restricted |
| spelling | oai:etd.uum.edu.my:109892024-02-20T01:33:34Z https://etd.uum.edu.my/10989/ Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly Siti Mariam, Man HE Transportation and Communications In the rapid growth of the semiconductor industry, subcontractors are highly competitive to gain their market segment and sustain the business. The ability to meet the shipment commits is critical, often gated by the process cycle time. Increasing challenges arise with high product customization in a make-to-order (MTO) environment. Such a company is Carsem (M) Sdn. Bhd. which had faced the issues of long cycle time resulting in shipment de-commits, and profit loss. The manual planning procedure could not cater to the demands of a quick turnaround for complex products 2024 Thesis NonPeerReviewed text en https://etd.uum.edu.my/10989/1/depositpermission-s900375.pdf text en https://etd.uum.edu.my/10989/2/s900375_01.pdf text en https://etd.uum.edu.my/10989/3/s900375_02.pdf Siti Mariam, Man (2024) Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly. Doctoral thesis, Universiti Utara Malaysia. |
| spellingShingle | HE Transportation and Communications Siti Mariam, Man Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly |
| thesis_level | PhD |
| title | Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly |
| title_full | Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly |
| title_fullStr | Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly |
| title_full_unstemmed | Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly |
| title_short | Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly |
| title_sort | development of wire bonding dispatch system using lean six sigma for semiconductor back end assembly |
| topic | HE Transportation and Communications |
| url | https://etd.uum.edu.my/10989/1/depositpermission-s900375.pdf https://etd.uum.edu.my/10989/2/s900375_01.pdf https://etd.uum.edu.my/10989/3/s900375_02.pdf https://etd.uum.edu.my/10989/ |
| work_keys_str_mv | AT sitimariamman developmentofwirebondingdispatchsystemusingleansixsigmaforsemiconductorbackendassembly |