Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly

In the rapid growth of the semiconductor industry, subcontractors are highly competitive to gain their market segment and sustain the business. The ability to meet the shipment commits is critical, often gated by the process cycle time. Increasing challenges arise with high product customization in...

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主要作者: Siti Mariam, Man
格式: Thesis
語言:英语
英语
英语
出版: 2024
主題:
在線閱讀:https://etd.uum.edu.my/10989/1/depositpermission-s900375.pdf
https://etd.uum.edu.my/10989/2/s900375_01.pdf
https://etd.uum.edu.my/10989/3/s900375_02.pdf
https://etd.uum.edu.my/10989/
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