The Development of a No-Clean Solder for Radio Frequency Power Module
The pursue of CFC elimination in many industries has opened up opportunity for the development of substitutes of CFC. No-clean solder is just one of the many examples in response to this need. This project describes the development of no-clean solder for radio frequency (RF) Power Module. Nine n...
| 第一著者: | |
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| フォーマット: | 学位論文 |
| 言語: | 英語 英語 |
| 出版事項: |
1997
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| 主題: | |
| オンライン・アクセス: | http://psasir.upm.edu.my/id/eprint/10021/1/FK_1997_15_A.pdf |