Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging

Total Productive Maintenance (TPM) methodologies are used to eliminate profit loss or waste due to equipment failure or defect. TPM is designed to get maximum efficiency from the equipment while creating a satisfactory working environment. In Motorola, Selangor yield improvement had been an impor...

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书目详细资料

主要作者:	Dharmalingam, Sivakumar
格式:	Thesis
语言:	英语
出版:	2004
主题:	Microelectronic packaging - Total roduction maintenance - Case studies
在线阅读:	http://psasir.upm.edu.my/id/eprint/5897/1/FK_2004_8%20IR.pdf