An Expert System for Trouble Shooting - Auto Wire Bonder Machine

An expert system to trouble shoot auto Wire bonder machine has been developed at Dpak product line, Motorola Semiconductor Sdn. Bhd., Seremban. This expert system is to provide a systematic and analytical procedure to trouble shoot Delvotec 6830 auto wire bonder. A rule-based expert system using...

詳細記述

書誌詳細

第一著者:	Ng, Yu Ting
フォーマット:	学位論文
言語:	英語 英語
出版事項:	1997
主題:	Wire bonding (Electronic packaging) - Case studies
オンライン･アクセス:	http://psasir.upm.edu.my/id/eprint/9996/1/FK_1997_3_A.pdf