Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe

Die attach material plays an important role in electronic packaging as it serves as an interconnection between SiC device and substrate, provides physical and mechanical support and serves as a heat dissipating path. An aluminum-copper (Al-Cu) nanopaste formulated by mixing Al and Cu nanoparticles w...

書誌詳細
第一著者:	Siah, Meng Zhe
フォーマット:	学位論文
出版事項:	2019
主題:	TJ Mechanical engineering and machinery

類似資料

Study of copper-aluminium high temperature die-attach material with different aluminium weight percentage /Shiu Kai Ping
著者:: Shiu , Kai Ping
出版事項: (2017)

Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications
著者:: Tan , Kim Seah
出版事項: (2015)

Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications
著者:: Tan , Kim Seah
出版事項: (2015)

Fabrication And Characterization Of Ag-Al Die Attach Material For Sic-Based High Temperature Device
著者:: Vemal , Raja Manikam
出版事項: (2012)

Optimization of silver nanoparticles sizes in ag-cu nanopaste as die-attach materials for high temperature applications
著者:: Noordin, Norasiah Mohammad
出版事項: (2017)

Software risk management tool : the statistical manager / Siah Guat Choon
著者:: Siah, Guat Choon
出版事項: (1999)

Motivation factors affecting project manager’s job performance in Malaysia and Singapore / Ng Zhe Xhiang
著者:: Ng , Zhe Xhiang
出版事項: (2024)

Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor / Erik Nino Tolentino
著者:: Erik Nino, Tolentino
出版事項: (2020)

Die system design with finite element for improving mechanical performance of extruded aluminium alloys and composites
著者:: Al-Jaryawy, Hani Mizhir Magid
出版事項: (2015)

Microstructural characterization of pressureless sintered silver die attached material
著者:: Esa, Siti Rahmah
出版事項: (2022)

Validation study of the Malay version of the 3-minute diagnostic interview for confusion assessment method defined delirium (3D-CAM) / Chin Yi Zhe
著者:: Chin , Yi Zhe
出版事項: (2016)

Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface
著者:: Yeo, Kian Hong
出版事項: (2016)

Characterization and mechanical properties of in-situ titanium diboride fibre reinforced aluminium-copper alloy composites
著者:: Ramli, Rosmamuhamadani
出版事項: (2016)

Development of high-temperature lead-free solder for semiconductor chip attachment / Ashraful Haque
著者:: Ashraful, Haque
出版事項: (2011)

Structural and magnetic properties of aluminium-copper substituted cobalt ferrite nanoparticles sintered at various temperatures
著者:: Dabagh, Shadab
出版事項: (2016)

Desorption of zinc (II) and copper (II) from palm oil fuel ash and activated carbon / by Chong Meng Tuck.
著者:: Chong, Meng Tuck
出版事項: (1999)

Evaluation of the effect of additives and their interactions on silicon morphology of aluminium-silicon-copper-magnesium cast alloy by thermal analysis
著者:: Farahany, Saeed
出版事項: (2012)

Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman.
著者:: Bustaman, Tengku Elisa
出版事項: (1999)

Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging / Low Pui Leng
著者:: Low, Pui Leng
出版事項: (2019)

Effect Of Nanosecond Laser Dicing On Ultrathin Silicon Die With Copper Stabilization Layer
著者:: Marks, Michael Raj
出版事項: (2016)

Smart learning environment system: e-Commerce module / Saw Yuen Meng @ Chua Yuen Meng
著者:: Saw @ Chua Yuen Meng, Yuen Meng
出版事項: (2001)

Finite Element Analysis and Optimization of Closed Die Forging Process for Aluminium Metal Matrix Composites
著者:: Abdulmawlla, Mohamed A.
出版事項: (2010)

Bismuth-argentum alloys as alternative high temperature lead-free solder
著者:: Rosilli, Rohaizuan
出版事項: (2012)

Curing profile optimization of silver epoxy die attach in ball grid array package process / Ng Qian Qing
著者:: Ng , Qian Qing
出版事項: (2024)

Effect Of Nb, Cr And W On The High Temperature Oxidation Behavior Of Ti-Al Alloys
著者:: Sapiai, Napisah
出版事項: (2011)

Morphological and mechanical characterisation of BI-AG alloy as high temperature lead free solder
著者:: Nahavandi, Mahdi
出版事項: (2014)

Characterization Of Fretting Fatigue of 7075-T6 Aluminium Alloy
著者:: Jacob, M. Suresh Devanesan
出版事項: (2006)

War and the problem of child soldiers / Yong Meng Yoong.
著者:: Yong, Meng Yoong
出版事項: (2002)

Office equipment inventory system / Teh Meng Hai
著者:: Teh, Meng Hai
出版事項: (2001)

Electric discharge machining characteristics of hardened tool steel using aluminium, copper and copper electroplated aluminium electrodes / Thilaga Vaani Nagalingam.
著者:: Nagalingam, Thilaga Vaani
出版事項: (2005)

Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
著者:: Law, Ruen Ching
出版事項: (2012)

The effect of substrate temperature of titanium aluminium nitride coating on titanium alloy (TI-6AL-4V) substrate using PVD method
著者:: Bahador, Hamid
出版事項: (2013)

Optimization of lubrication techniques on machining performance of aluminium alloy 319
著者:: Zainal Ariffin, Selamat
出版事項: (2018)

Multiaxial Fatigue Behaviour Of Heat Treated 6061 Aluminium Alloy
著者:: Marno, Marini
出版事項: (2011)

Properties of titanium carbide reinforced aluminium silicon alloy matrix
著者:: M. Sayuti,
出版事項: (2012)

Multiaxial Fatigue Behaviour Of Heat Treated 6061 Aluminium Alloy
著者:: Marno, Marini
出版事項: (2011)

Alloying of aluminium surface with Q-switched Nd:YAG laser
著者:: Shaharin, Mohd. Shafiq
出版事項: (2015)

Optimization Of Welding Parameters On Mechanical Properties Of Aluminium Alloy 7075
著者:: Yomli, Sofia Mulyani
出版事項: (2019)

High-temperature electrolysis of copper chloride using hybrid proton exchange membrane for hydrogen production
著者:: Ahmad Kamaroddin, Mohd Fadhzir
出版事項: (2022)

Corrosion of palladium coated copper wire bonds under high temperature storage reliability test
著者:: Cha, Chan Lam
出版事項: (2021)

Cannot write session to /tmp/vufind_sessions/sess_fki0tbf9k4kbts51c2lelih3qc