Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe

Die attach material plays an important role in electronic packaging as it serves as an interconnection between SiC device and substrate, provides physical and mechanical support and serves as a heat dissipating path. An aluminum-copper (Al-Cu) nanopaste formulated by mixing Al and Cu nanoparticles w...

وصف كامل

التفاصيل البيبلوغرافية
المؤلف الرئيسي:	Siah, Meng Zhe
التنسيق:	أطروحة
منشور في:	2019
الموضوعات:	TJ Mechanical engineering and machinery

مواد مشابهة

Study of copper-aluminium high temperature die-attach material with different aluminium weight percentage /Shiu Kai Ping
حسب: Shiu , Kai Ping
منشور في: (2017)

Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications
حسب: Tan , Kim Seah
منشور في: (2015)

Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications
حسب: Tan , Kim Seah
منشور في: (2015)

Fabrication And Characterization Of Ag-Al Die Attach Material For Sic-Based High Temperature Device
حسب: Vemal , Raja Manikam
منشور في: (2012)

Optimization of silver nanoparticles sizes in ag-cu nanopaste as die-attach materials for high temperature applications
حسب: Noordin, Norasiah Mohammad
منشور في: (2017)

Software risk management tool : the statistical manager / Siah Guat Choon
حسب: Siah, Guat Choon
منشور في: (1999)

Motivation factors affecting project manager’s job performance in Malaysia and Singapore / Ng Zhe Xhiang
حسب: Ng , Zhe Xhiang
منشور في: (2024)

Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor / Erik Nino Tolentino
حسب: Erik Nino, Tolentino
منشور في: (2020)

Die system design with finite element for improving mechanical performance of extruded aluminium alloys and composites
حسب: Al-Jaryawy, Hani Mizhir Magid
منشور في: (2015)

Microstructural characterization of pressureless sintered silver die attached material
حسب: Esa, Siti Rahmah
منشور في: (2022)

Validation study of the Malay version of the 3-minute diagnostic interview for confusion assessment method defined delirium (3D-CAM) / Chin Yi Zhe
حسب: Chin , Yi Zhe
منشور في: (2016)

Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface
حسب: Yeo, Kian Hong
منشور في: (2016)

Characterization and mechanical properties of in-situ titanium diboride fibre reinforced aluminium-copper alloy composites
حسب: Ramli, Rosmamuhamadani
منشور في: (2016)

Development of high-temperature lead-free solder for semiconductor chip attachment / Ashraful Haque
حسب: Ashraful, Haque
منشور في: (2011)

Structural and magnetic properties of aluminium-copper substituted cobalt ferrite nanoparticles sintered at various temperatures
حسب: Dabagh, Shadab
منشور في: (2016)

Desorption of zinc (II) and copper (II) from palm oil fuel ash and activated carbon / by Chong Meng Tuck.
حسب: Chong, Meng Tuck
منشور في: (1999)

Evaluation of the effect of additives and their interactions on silicon morphology of aluminium-silicon-copper-magnesium cast alloy by thermal analysis
حسب: Farahany, Saeed
منشور في: (2012)

Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman.
حسب: Bustaman, Tengku Elisa
منشور في: (1999)

Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging / Low Pui Leng
حسب: Low, Pui Leng
منشور في: (2019)

Effect Of Nanosecond Laser Dicing On Ultrathin Silicon Die With Copper Stabilization Layer
حسب: Marks, Michael Raj
منشور في: (2016)

Smart learning environment system: e-Commerce module / Saw Yuen Meng @ Chua Yuen Meng
حسب: Saw @ Chua Yuen Meng, Yuen Meng
منشور في: (2001)

Finite Element Analysis and Optimization of Closed Die Forging Process for Aluminium Metal Matrix Composites
حسب: Abdulmawlla, Mohamed A.
منشور في: (2010)

Bismuth-argentum alloys as alternative high temperature lead-free solder
حسب: Rosilli, Rohaizuan
منشور في: (2012)

Curing profile optimization of silver epoxy die attach in ball grid array package process / Ng Qian Qing
حسب: Ng , Qian Qing
منشور في: (2024)

Effect Of Nb, Cr And W On The High Temperature Oxidation Behavior Of Ti-Al Alloys
حسب: Sapiai, Napisah
منشور في: (2011)

Morphological and mechanical characterisation of BI-AG alloy as high temperature lead free solder
حسب: Nahavandi, Mahdi
منشور في: (2014)

Characterization Of Fretting Fatigue of 7075-T6 Aluminium Alloy
حسب: Jacob, M. Suresh Devanesan
منشور في: (2006)

War and the problem of child soldiers / Yong Meng Yoong.
حسب: Yong, Meng Yoong
منشور في: (2002)

Office equipment inventory system / Teh Meng Hai
حسب: Teh, Meng Hai
منشور في: (2001)

Electric discharge machining characteristics of hardened tool steel using aluminium, copper and copper electroplated aluminium electrodes / Thilaga Vaani Nagalingam.
حسب: Nagalingam, Thilaga Vaani
منشور في: (2005)

Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
حسب: Law, Ruen Ching
منشور في: (2012)

The effect of substrate temperature of titanium aluminium nitride coating on titanium alloy (TI-6AL-4V) substrate using PVD method
حسب: Bahador, Hamid
منشور في: (2013)

Optimization of lubrication techniques on machining performance of aluminium alloy 319
حسب: Zainal Ariffin, Selamat
منشور في: (2018)

Multiaxial Fatigue Behaviour Of Heat Treated 6061 Aluminium Alloy
حسب: Marno, Marini
منشور في: (2011)

Properties of titanium carbide reinforced aluminium silicon alloy matrix
حسب: M. Sayuti,
منشور في: (2012)

Multiaxial Fatigue Behaviour Of Heat Treated 6061 Aluminium Alloy
حسب: Marno, Marini
منشور في: (2011)

Alloying of aluminium surface with Q-switched Nd:YAG laser
حسب: Shaharin, Mohd. Shafiq
منشور في: (2015)

Optimization Of Welding Parameters On Mechanical Properties Of Aluminium Alloy 7075
حسب: Yomli, Sofia Mulyani
منشور في: (2019)

High-temperature electrolysis of copper chloride using hybrid proton exchange membrane for hydrogen production
حسب: Ahmad Kamaroddin, Mohd Fadhzir
منشور في: (2022)

Corrosion of palladium coated copper wire bonds under high temperature storage reliability test
حسب: Cha, Chan Lam
منشور في: (2021)

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