Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe

Die attach material plays an important role in electronic packaging as it serves as an interconnection between SiC device and substrate, provides physical and mechanical support and serves as a heat dissipating path. An aluminum-copper (Al-Cu) nanopaste formulated by mixing Al and Cu nanoparticles w...

Full description

Bibliographic Details
Main Author:	Siah, Meng Zhe
Format:	Thesis
Published:	2019
Subjects:	TJ Mechanical engineering and machinery

Similar Items

Study of copper-aluminium high temperature die-attach material with different aluminium weight percentage /Shiu Kai Ping
by: Shiu , Kai Ping
Published: (2017)

Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications
by: Tan , Kim Seah
Published: (2015)

Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications
by: Tan , Kim Seah
Published: (2015)

Fabrication And Characterization Of Ag-Al Die Attach Material For Sic-Based High Temperature Device
by: Vemal , Raja Manikam
Published: (2012)

Optimization of silver nanoparticles sizes in ag-cu nanopaste as die-attach materials for high temperature applications
by: Noordin, Norasiah Mohammad
Published: (2017)

Software risk management tool : the statistical manager / Siah Guat Choon
by: Siah, Guat Choon
Published: (1999)

Motivation factors affecting project manager’s job performance in Malaysia and Singapore / Ng Zhe Xhiang
by: Ng , Zhe Xhiang
Published: (2024)

Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor / Erik Nino Tolentino
by: Erik Nino, Tolentino
Published: (2020)

Die system design with finite element for improving mechanical performance of extruded aluminium alloys and composites
by: Al-Jaryawy, Hani Mizhir Magid
Published: (2015)

Microstructural characterization of pressureless sintered silver die attached material
by: Esa, Siti Rahmah
Published: (2022)

Validation study of the Malay version of the 3-minute diagnostic interview for confusion assessment method defined delirium (3D-CAM) / Chin Yi Zhe
by: Chin , Yi Zhe
Published: (2016)

Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface
by: Yeo, Kian Hong
Published: (2016)

Characterization and mechanical properties of in-situ titanium diboride fibre reinforced aluminium-copper alloy composites
by: Ramli, Rosmamuhamadani
Published: (2016)

Development of high-temperature lead-free solder for semiconductor chip attachment / Ashraful Haque
by: Ashraful, Haque
Published: (2011)

Structural and magnetic properties of aluminium-copper substituted cobalt ferrite nanoparticles sintered at various temperatures
by: Dabagh, Shadab
Published: (2016)

Desorption of zinc (II) and copper (II) from palm oil fuel ash and activated carbon / by Chong Meng Tuck.
by: Chong, Meng Tuck
Published: (1999)

Evaluation of the effect of additives and their interactions on silicon morphology of aluminium-silicon-copper-magnesium cast alloy by thermal analysis
by: Farahany, Saeed
Published: (2012)

Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman.
by: Bustaman, Tengku Elisa
Published: (1999)

Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging / Low Pui Leng
by: Low, Pui Leng
Published: (2019)

Effect Of Nanosecond Laser Dicing On Ultrathin Silicon Die With Copper Stabilization Layer
by: Marks, Michael Raj
Published: (2016)

Smart learning environment system: e-Commerce module / Saw Yuen Meng @ Chua Yuen Meng
by: Saw @ Chua Yuen Meng, Yuen Meng
Published: (2001)

Finite Element Analysis and Optimization of Closed Die Forging Process for Aluminium Metal Matrix Composites
by: Abdulmawlla, Mohamed A.
Published: (2010)

Bismuth-argentum alloys as alternative high temperature lead-free solder
by: Rosilli, Rohaizuan
Published: (2012)

Curing profile optimization of silver epoxy die attach in ball grid array package process / Ng Qian Qing
by: Ng , Qian Qing
Published: (2024)

Effect Of Nb, Cr And W On The High Temperature Oxidation Behavior Of Ti-Al Alloys
by: Sapiai, Napisah
Published: (2011)

Morphological and mechanical characterisation of BI-AG alloy as high temperature lead free solder
by: Nahavandi, Mahdi
Published: (2014)

Characterization Of Fretting Fatigue of 7075-T6 Aluminium Alloy
by: Jacob, M. Suresh Devanesan
Published: (2006)

War and the problem of child soldiers / Yong Meng Yoong.
by: Yong, Meng Yoong
Published: (2002)

Office equipment inventory system / Teh Meng Hai
by: Teh, Meng Hai
Published: (2001)

Electric discharge machining characteristics of hardened tool steel using aluminium, copper and copper electroplated aluminium electrodes / Thilaga Vaani Nagalingam.
by: Nagalingam, Thilaga Vaani
Published: (2005)

Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
by: Law, Ruen Ching
Published: (2012)

The effect of substrate temperature of titanium aluminium nitride coating on titanium alloy (TI-6AL-4V) substrate using PVD method
by: Bahador, Hamid
Published: (2013)

Optimization of lubrication techniques on machining performance of aluminium alloy 319
by: Zainal Ariffin, Selamat
Published: (2018)

Multiaxial Fatigue Behaviour Of Heat Treated 6061 Aluminium Alloy
by: Marno, Marini
Published: (2011)

Properties of titanium carbide reinforced aluminium silicon alloy matrix
by: M. Sayuti,
Published: (2012)

Multiaxial Fatigue Behaviour Of Heat Treated 6061 Aluminium Alloy
by: Marno, Marini
Published: (2011)

Alloying of aluminium surface with Q-switched Nd:YAG laser
by: Shaharin, Mohd. Shafiq
Published: (2015)

Optimization Of Welding Parameters On Mechanical Properties Of Aluminium Alloy 7075
by: Yomli, Sofia Mulyani
Published: (2019)

High-temperature electrolysis of copper chloride using hybrid proton exchange membrane for hydrogen production
by: Ahmad Kamaroddin, Mohd Fadhzir
Published: (2022)

Corrosion of palladium coated copper wire bonds under high temperature storage reliability test
by: Cha, Chan Lam
Published: (2021)