Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe
Die attach material plays an important role in electronic packaging as it serves as an interconnection between SiC device and substrate, provides physical and mechanical support and serves as a heat dissipating path. An aluminum-copper (Al-Cu) nanopaste formulated by mixing Al and Cu nanoparticles w...
| मुख्य लेखक: | Siah, Meng Zhe |
|---|---|
| स्वरूप: | थीसिस |
| प्रकाशित: |
2019
|
| विषय: |
समान संसाधन
Study of copper-aluminium high temperature die-attach material with different aluminium weight percentage /Shiu Kai Ping
द्वारा: Shiu , Kai Ping
प्रकाशित: (2017)
द्वारा: Shiu , Kai Ping
प्रकाशित: (2017)
Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications
द्वारा: Tan , Kim Seah
प्रकाशित: (2015)
द्वारा: Tan , Kim Seah
प्रकाशित: (2015)
Investigations On Silver-Copper
Nanopaste As Die-Attach Material For
High Temperature Applications
द्वारा: Tan , Kim Seah
प्रकाशित: (2015)
द्वारा: Tan , Kim Seah
प्रकाशित: (2015)
Fabrication And Characterization Of Ag-Al Die Attach Material For Sic-Based High Temperature Device
द्वारा: Vemal , Raja Manikam
प्रकाशित: (2012)
द्वारा: Vemal , Raja Manikam
प्रकाशित: (2012)
Optimization of silver nanoparticles sizes in ag-cu nanopaste as die-attach materials for high temperature applications
द्वारा: Noordin, Norasiah Mohammad
प्रकाशित: (2017)
द्वारा: Noordin, Norasiah Mohammad
प्रकाशित: (2017)
Software risk management tool : the statistical manager / Siah Guat Choon
द्वारा: Siah, Guat Choon
प्रकाशित: (1999)
द्वारा: Siah, Guat Choon
प्रकाशित: (1999)
Motivation factors affecting project manager’s job performance in Malaysia and Singapore / Ng Zhe Xhiang
द्वारा: Ng , Zhe Xhiang
प्रकाशित: (2024)
द्वारा: Ng , Zhe Xhiang
प्रकाशित: (2024)
Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor / Erik Nino Tolentino
द्वारा: Erik Nino, Tolentino
प्रकाशित: (2020)
द्वारा: Erik Nino, Tolentino
प्रकाशित: (2020)
Die system design with finite element for improving mechanical performance of extruded aluminium alloys and composites
द्वारा: Al-Jaryawy, Hani Mizhir Magid
प्रकाशित: (2015)
द्वारा: Al-Jaryawy, Hani Mizhir Magid
प्रकाशित: (2015)
Microstructural characterization of pressureless sintered silver die attached material
द्वारा: Esa, Siti Rahmah
प्रकाशित: (2022)
द्वारा: Esa, Siti Rahmah
प्रकाशित: (2022)
Validation study of the Malay version of the 3-minute diagnostic interview for confusion assessment method defined delirium (3D-CAM) / Chin Yi Zhe
द्वारा: Chin , Yi Zhe
प्रकाशित: (2016)
द्वारा: Chin , Yi Zhe
प्रकाशित: (2016)
Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface
द्वारा: Yeo, Kian Hong
प्रकाशित: (2016)
द्वारा: Yeo, Kian Hong
प्रकाशित: (2016)
Characterization and mechanical properties of in-situ titanium diboride fibre reinforced aluminium-copper alloy composites
द्वारा: Ramli, Rosmamuhamadani
प्रकाशित: (2016)
द्वारा: Ramli, Rosmamuhamadani
प्रकाशित: (2016)
Development of high-temperature lead-free solder for semiconductor chip attachment / Ashraful Haque
द्वारा: Ashraful, Haque
प्रकाशित: (2011)
द्वारा: Ashraful, Haque
प्रकाशित: (2011)
Structural and magnetic properties of aluminium-copper substituted cobalt ferrite nanoparticles sintered at various temperatures
द्वारा: Dabagh, Shadab
प्रकाशित: (2016)
द्वारा: Dabagh, Shadab
प्रकाशित: (2016)
Desorption of zinc (II) and copper (II) from palm oil fuel ash and activated carbon / by Chong Meng Tuck.
द्वारा: Chong, Meng Tuck
प्रकाशित: (1999)
द्वारा: Chong, Meng Tuck
प्रकाशित: (1999)
Evaluation of the effect of additives and their interactions on silicon morphology of aluminium-silicon-copper-magnesium cast alloy by thermal analysis
द्वारा: Farahany, Saeed
प्रकाशित: (2012)
द्वारा: Farahany, Saeed
प्रकाशित: (2012)
Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman.
द्वारा: Bustaman, Tengku Elisa
प्रकाशित: (1999)
द्वारा: Bustaman, Tengku Elisa
प्रकाशित: (1999)
Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging / Low Pui Leng
द्वारा: Low, Pui Leng
प्रकाशित: (2019)
द्वारा: Low, Pui Leng
प्रकाशित: (2019)
Effect Of Nanosecond Laser Dicing On Ultrathin Silicon Die With Copper Stabilization Layer
द्वारा: Marks, Michael Raj
प्रकाशित: (2016)
द्वारा: Marks, Michael Raj
प्रकाशित: (2016)
Smart learning environment system: e-Commerce module / Saw Yuen Meng @ Chua Yuen Meng
द्वारा: Saw @ Chua Yuen Meng, Yuen Meng
प्रकाशित: (2001)
द्वारा: Saw @ Chua Yuen Meng, Yuen Meng
प्रकाशित: (2001)
Finite Element Analysis and Optimization of Closed Die Forging Process for Aluminium Metal Matrix Composites
द्वारा: Abdulmawlla, Mohamed A.
प्रकाशित: (2010)
द्वारा: Abdulmawlla, Mohamed A.
प्रकाशित: (2010)
Bismuth-argentum alloys as alternative high temperature lead-free solder
द्वारा: Rosilli, Rohaizuan
प्रकाशित: (2012)
द्वारा: Rosilli, Rohaizuan
प्रकाशित: (2012)
Curing profile optimization of silver epoxy die attach in ball grid array package process / Ng Qian Qing
द्वारा: Ng , Qian Qing
प्रकाशित: (2024)
द्वारा: Ng , Qian Qing
प्रकाशित: (2024)
Effect Of Nb, Cr And W On The High Temperature Oxidation
Behavior Of Ti-Al Alloys
द्वारा: Sapiai, Napisah
प्रकाशित: (2011)
द्वारा: Sapiai, Napisah
प्रकाशित: (2011)
Morphological and mechanical characterisation of BI-AG alloy as high temperature lead free solder
द्वारा: Nahavandi, Mahdi
प्रकाशित: (2014)
द्वारा: Nahavandi, Mahdi
प्रकाशित: (2014)
Characterization Of Fretting Fatigue of 7075-T6 Aluminium Alloy
द्वारा: Jacob, M. Suresh Devanesan
प्रकाशित: (2006)
द्वारा: Jacob, M. Suresh Devanesan
प्रकाशित: (2006)
War and the problem of child soldiers / Yong Meng Yoong.
द्वारा: Yong, Meng Yoong
प्रकाशित: (2002)
द्वारा: Yong, Meng Yoong
प्रकाशित: (2002)
Office equipment inventory system / Teh Meng Hai
द्वारा: Teh, Meng Hai
प्रकाशित: (2001)
द्वारा: Teh, Meng Hai
प्रकाशित: (2001)
Electric discharge machining characteristics of hardened tool steel using aluminium, copper and copper electroplated aluminium electrodes / Thilaga Vaani Nagalingam.
द्वारा: Nagalingam, Thilaga Vaani
प्रकाशित: (2005)
द्वारा: Nagalingam, Thilaga Vaani
प्रकाशित: (2005)
Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
द्वारा: Law, Ruen Ching
प्रकाशित: (2012)
द्वारा: Law, Ruen Ching
प्रकाशित: (2012)
The effect of substrate temperature of titanium aluminium nitride coating on titanium alloy (TI-6AL-4V) substrate using PVD method
द्वारा: Bahador, Hamid
प्रकाशित: (2013)
द्वारा: Bahador, Hamid
प्रकाशित: (2013)
Optimization of lubrication techniques on machining performance of aluminium alloy 319
द्वारा: Zainal Ariffin, Selamat
प्रकाशित: (2018)
द्वारा: Zainal Ariffin, Selamat
प्रकाशित: (2018)
Multiaxial Fatigue Behaviour Of Heat Treated 6061 Aluminium Alloy
द्वारा: Marno, Marini
प्रकाशित: (2011)
द्वारा: Marno, Marini
प्रकाशित: (2011)
Properties of titanium carbide reinforced aluminium silicon alloy matrix
द्वारा: M. Sayuti,
प्रकाशित: (2012)
द्वारा: M. Sayuti,
प्रकाशित: (2012)
Multiaxial Fatigue Behaviour Of Heat Treated 6061 Aluminium Alloy
द्वारा: Marno, Marini
प्रकाशित: (2011)
द्वारा: Marno, Marini
प्रकाशित: (2011)
Alloying of aluminium surface with Q-switched Nd:YAG laser
द्वारा: Shaharin, Mohd. Shafiq
प्रकाशित: (2015)
द्वारा: Shaharin, Mohd. Shafiq
प्रकाशित: (2015)
Optimization Of Welding Parameters On Mechanical Properties Of Aluminium Alloy 7075
द्वारा: Yomli, Sofia Mulyani
प्रकाशित: (2019)
द्वारा: Yomli, Sofia Mulyani
प्रकाशित: (2019)
High-temperature electrolysis of copper chloride using hybrid proton exchange membrane for hydrogen production
द्वारा: Ahmad Kamaroddin, Mohd Fadhzir
प्रकाशित: (2022)
द्वारा: Ahmad Kamaroddin, Mohd Fadhzir
प्रकाशित: (2022)
Corrosion of palladium coated copper wire bonds under high temperature storage reliability test
द्वारा: Cha, Chan Lam
प्रकाशित: (2021)
द्वारा: Cha, Chan Lam
प्रकाशित: (2021)
समान संसाधन
-
Study of copper-aluminium high temperature die-attach material with different aluminium weight percentage /Shiu Kai Ping
द्वारा: Shiu , Kai Ping
प्रकाशित: (2017) -
Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications
द्वारा: Tan , Kim Seah
प्रकाशित: (2015) -
Investigations On Silver-Copper
Nanopaste As Die-Attach Material For
High Temperature Applications
द्वारा: Tan , Kim Seah
प्रकाशित: (2015) -
Fabrication And Characterization Of Ag-Al Die Attach Material For Sic-Based High Temperature Device
द्वारा: Vemal , Raja Manikam
प्रकाशित: (2012) -
Optimization of silver nanoparticles sizes in ag-cu nanopaste as die-attach materials for high temperature applications
द्वारा: Noordin, Norasiah Mohammad
प्रकाशित: (2017)