Effect of Zn additions on the electrochemical migration behaviour of SAC305 solder alloys / Loh Hwei Ling
The inclusion of lead within the European Union’s Restriction of Hazardous Substances list has led to a push within the microelectronics industry for a suitable non-lead solder alloy substitute with comparable mechanical and chemical properties. Tin-silver-copper (Sn-Ag-Cu) alloys with the addition...
| المؤلف الرئيسي: | |
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| التنسيق: | أطروحة |
| منشور في: |
2019
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| الموضوعات: |