Erik Nino, T. (2020). Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor / Erik Nino Tolentino.
Chicago Style (17th ed.) CitationErik Nino, Tolentino. Comparison of Pressure-assist Silver Sintering to Tin Silver Solder Alloy as Die Attach Material in High Power Semiconductor / Erik Nino Tolentino. 2020.
MLA (9th ed.) CitationErik Nino, Tolentino. Comparison of Pressure-assist Silver Sintering to Tin Silver Solder Alloy as Die Attach Material in High Power Semiconductor / Erik Nino Tolentino. 2020.
Warning: These citations may not always be 100% accurate.