Erik Nino, T. (2020). Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor / Erik Nino Tolentino.
Style de citation Chicago (17e éd.)Erik Nino, Tolentino. Comparison of Pressure-assist Silver Sintering to Tin Silver Solder Alloy as Die Attach Material in High Power Semiconductor / Erik Nino Tolentino. 2020.
Style de citation MLA (9e éd.)Erik Nino, Tolentino. Comparison of Pressure-assist Silver Sintering to Tin Silver Solder Alloy as Die Attach Material in High Power Semiconductor / Erik Nino Tolentino. 2020.
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