Erik Nino, T. (2020). Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor / Erik Nino Tolentino.
Chicagoスタイル(17版)引用形式Erik Nino, Tolentino. Comparison of Pressure-assist Silver Sintering to Tin Silver Solder Alloy as Die Attach Material in High Power Semiconductor / Erik Nino Tolentino. 2020.
MLA(9版)引用形式Erik Nino, Tolentino. Comparison of Pressure-assist Silver Sintering to Tin Silver Solder Alloy as Die Attach Material in High Power Semiconductor / Erik Nino Tolentino. 2020.
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