Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor / Erik Nino Tolentino
The research is focused on pressure-assisted silver sintering material that is compared to tin silver solder alloy paste as used in power electronics. Material characterization, electrical tests, and reliability tests were conducted in the experiment. After drying process, it was observed that the A...
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| フォーマット: | 学位論文 |
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2020
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