Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn / Leong Yee Mei
Driven by the recent trend towards miniaturization of lead free electronic products, researchers are putting immense efforts to improve the properties and reliability of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC 105 (Sn-1.0Ag-0.5Cu) solder because...
| मुख्य लेखक: | Leong , Yee Mei |
|---|---|
| स्वरूप: | थीसिस |
| प्रकाशित: |
2020
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| विषय: |
समान संसाधन
Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate
द्वारा: Ghani, Fitriah Abdul
प्रकाशित: (2018)
द्वारा: Ghani, Fitriah Abdul
प्रकाशित: (2018)
Studies on intermetallics and physical properties of Sn-3.5Ag-1.0Cu lead free solder with Zn additive / Iziana Yahya
द्वारा: Yahya, Iziana
प्रकाशित: (2016)
द्वारा: Yahya, Iziana
प्रकाशित: (2016)
Study Of Wettability And Corrosion Behavior Of Sn-37pb, Sn-8zn-3bi And Sn-3ag-0.5cu Solders
द्वारा: Ridhai, Mohammed Noori
प्रकाशित: (2010)
द्वारा: Ridhai, Mohammed Noori
प्रकाशित: (2010)
Microstructural evaluation of sn3.0ag0.5cu solder alloy fabricated via powder metallurgy method
द्वारा: Nadhrah, Murad
प्रकाशित: (2021)
द्वारा: Nadhrah, Murad
प्रकाशित: (2021)
Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag 0.5Cu solder alloys bearing Fe and Bi / Mohammad Hossein Mahdavifard
द्वारा: Mohammad Hossein, Mahdavifard
प्रकाशित: (2017)
द्वारा: Mohammad Hossein, Mahdavifard
प्रकाशित: (2017)
Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
द्वारा: Tai, Siew Fong
प्रकाशित: (2003)
द्वारा: Tai, Siew Fong
प्रकाशित: (2003)
The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating
द्वारा: Maliessa Nabilah, Mazelan
प्रकाशित: (2023)
द्वारा: Maliessa Nabilah, Mazelan
प्रकाशित: (2023)
Characterization And Corrosion Behaviour Of 96.5sn-3.0ag- 0.5cu Solder On Cu Substrate At Different Reflow Reactions
द्वारा: Lee , Liu Mei
प्रकाशित: (2013)
द्वारा: Lee , Liu Mei
प्रकाशित: (2013)
Characterization and corrosion behaviour of 96.5Sn-3.0Ag-0.5Cu solder on Cu substrate at different reflow reactions
द्वारा: Lee, Liu Mei
प्रकाशित: (2013)
द्वारा: Lee, Liu Mei
प्रकाशित: (2013)
Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish
द्वारा: Osman, Saliza Azlina
प्रकाशित: (2008)
द्वारा: Osman, Saliza Azlina
प्रकाशित: (2008)
Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process
द्वारा: Chellvarajoo, Srivalli
प्रकाशित: (2016)
द्वारा: Chellvarajoo, Srivalli
प्रकाशित: (2016)
Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process
द्वारा: Chellvarajoo, Srivalli
प्रकाशित: (2016)
द्वारा: Chellvarajoo, Srivalli
प्रकाशित: (2016)
Study on intermetallic compound formation and growth at the solder joint interface during laser soldering using sn-ag-cu powdered compact solder on copper pad
द्वारा: Nabila, Tamar Jaya
प्रकाशित: (2024)
द्वारा: Nabila, Tamar Jaya
प्रकाशित: (2024)
Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes
द्वारा: Abu Hassan, Nurfazlin
प्रकाशित: (2009)
द्वारा: Abu Hassan, Nurfazlin
प्रकाशित: (2009)
Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
द्वारा: Idris, Siti Rabiatull Aisha
प्रकाशित: (2008)
द्वारा: Idris, Siti Rabiatull Aisha
प्रकाशित: (2008)
Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani
द्वारा: Ab Ghani, Noor Asikin
प्रकाशित: (2016)
द्वारा: Ab Ghani, Noor Asikin
प्रकाशित: (2016)
Effect Of Indium Addition On Microstructure, Wettability, Shear Strength And Creep Behavior Of Sn100c Solder
द्वारा: Abdullah, Nabihah
प्रकाशित: (2019)
द्वारा: Abdullah, Nabihah
प्रकाशित: (2019)
Effect of indium addition on microstructure, wettability, shear strength and creep behavior of sn100c solder
द्वारा: Abdullah, Nabihah
प्रकाशित: (2019)
द्वारा: Abdullah, Nabihah
प्रकाशित: (2019)
Microstructural characteristics and mechanical performance of Bi-Sb-Ni added Sn 3.0Ag-0.5Cu multicomponent lead-free solder alloy / Zhou Ding
द्वारा: Zhou , Ding
प्रकाशित: (2024)
द्वारा: Zhou , Ding
प्रकाशित: (2024)
Isothermal Aging Of Sn-3.0ag-0.5cu And Sn100c Solder Alloys Processed Via Equal Channel Angular Pressing
द्वारा: Baser, Muhammad Fadlin Hazim
प्रकाशित: (2020)
द्वारा: Baser, Muhammad Fadlin Hazim
प्रकाशित: (2020)
The Influence Of Gallium Addition On The Properties Of Sn3.0Ag0.5Cu Lead Free Solder [TD799.85. F146 2008 f rb].
द्वारा: Zakaria, Mohamad Fadley
प्रकाशित: (2008)
द्वारा: Zakaria, Mohamad Fadley
प्रकाशित: (2008)
Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization
द्वारा: Mayappan, Ramani
प्रकाशित: (2007)
द्वारा: Mayappan, Ramani
प्रकाशित: (2007)
Effects of Zn and A1 on corrosion characteristics of Sn-1.0Ag-0.5Cu alloys / Nurul Liyana Kamaruzaman
द्वारा: Nurul Liyana, Kamaruzaman
प्रकाशित: (2018)
द्वारा: Nurul Liyana, Kamaruzaman
प्रकाशित: (2018)
Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
द्वारा: Hashim, Md. Amin
प्रकाशित: (2011)
द्वारा: Hashim, Md. Amin
प्रकाशित: (2011)
Effect Of Grain Refinement Process Using Equal Channel Angular Pressing On The Properties And Corrosion Behaviour Of Sn-3.0ag-0.5Cu Solder
द्वारा: Abu Bakar, Nur Adriana Nazifa
प्रकाशित: (2019)
द्वारा: Abu Bakar, Nur Adriana Nazifa
प्रकाशित: (2019)
Interfacial analysis of carbon nanotubes-reinforced and graphene-reinforced Sn-1.0Ag-0.5Cu solder on electroless nickel/ immersion silver surface finish
द्वारा: Krishna, Vidyatharran
प्रकाशित: (2020)
द्वारा: Krishna, Vidyatharran
प्रकाशित: (2020)
Efficiency enhancement of photoelectrochemical water splitting by heterostructures Ag/MoS2/ZnO photoanode / Chia Mei Yuen
द्वारा: Chia , Mei Yuen
प्रकाशित: (2022)
द्वारा: Chia , Mei Yuen
प्रकाशित: (2022)
Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].
द्वारा: Mayappan, Ramani
प्रकाशित: (2007)
द्वारा: Mayappan, Ramani
प्रकाशित: (2007)
Visible-light photodegradation of nitrobenzene by microwave synthesized ZnO and its nanocomposites Ag/ZnO and Cu/ZnO
द्वारा: Sidi, Hauwa Aliyu
प्रकाशित: (2014)
द्वारा: Sidi, Hauwa Aliyu
प्रकाशित: (2014)
Effect of nickel doping into solder alloy and its strength between SnCu-Ni/immersion gold joint
द्वारा: Zetty Akhtar, Abd Malek
प्रकाशित: (2017)
द्वारा: Zetty Akhtar, Abd Malek
प्रकाशित: (2017)
Electroplating Of Cu-Sn Alloys And Compositionally Modulated Multilayers Of Cu-Sn-Zn-Ni Alloys On Mild Steel Substrate [TS693. H282 2007 f rb].
द्वारा: Hariyanti, Hariyanti
प्रकाशित: (2007)
द्वारा: Hariyanti, Hariyanti
प्रकाशित: (2007)
Effect Of Al Addition To Imc Formation, Mechanical And Wetting Properties Of Low-Ag Sac Solder Alloy
द्वारा: Kamarudin, Maslina
प्रकाशित: (2015)
द्वारा: Kamarudin, Maslina
प्रकाशित: (2015)
Cu2ZnSnS4 (CZTS) Thin Film Grown By Electrochemical Deposition For Solar Cell
द्वारा: Mrzog, Elmoiz Marghni Mkawi
प्रकाशित: (2015)
द्वारा: Mrzog, Elmoiz Marghni Mkawi
प्रकाशित: (2015)
'Interpretive genres' in natural history : a socio-cognitive perspective / Yee Chee Leong
द्वारा: Yee, Chee Leong
प्रकाशित: (2012)
द्वारा: Yee, Chee Leong
प्रकाशित: (2012)
Effect of Zn additions on the electrochemical migration behaviour of SAC305 solder alloys / Loh Hwei Ling
द्वारा: Loh, Hwei Ling
प्रकाशित: (2019)
द्वारा: Loh, Hwei Ling
प्रकाशित: (2019)
Investigations On The Properties Of Sn-8zn-3Bi Lead-Free And Sn-37Pb Eutectic Solder Alloys [TS610. D928 2005 f rb] [Microfiche 8175].
द्वारा: Duong, Ngoc Binh
प्रकाशित: (2005)
द्वारा: Duong, Ngoc Binh
प्रकाशित: (2005)
Physicochemical and tribological analysis of chemically modified microalgae oil blends for Malaysian conditions / Cheah Mei Yee
द्वारा: Cheah , Mei Yee
प्रकाशित: (2019)
द्वारा: Cheah , Mei Yee
प्रकाशित: (2019)
Interfacial microstructure growth mechanism of lead-free solder using laser soldering
द्वारा: Muhammad Asyraf, Abdullah
प्रकाशित: (2024)
द्वारा: Muhammad Asyraf, Abdullah
प्रकाशित: (2024)
Microstructural and Dielectric Properties of (Ba,Nb)(Ti,Cu)O₃-(BNTC) and (Ba,Nb)(Ti,Sn)O₃-(BNTS) Ceramics
द्वारा: Keophilavong, Somsathith
प्रकाशित: (2003)
द्वारा: Keophilavong, Somsathith
प्रकाशित: (2003)
Principal technology leadership practices, teacher ICT competency, and teacher acceptance of School Management System (SMS) in Negeri Sembilan secondary schools / Leong Mei Wei
द्वारा: Leong, Mei Wei
प्रकाशित: (2017)
द्वारा: Leong, Mei Wei
प्रकाशित: (2017)
समान संसाधन
-
Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate
द्वारा: Ghani, Fitriah Abdul
प्रकाशित: (2018) -
Studies on intermetallics and physical properties of Sn-3.5Ag-1.0Cu lead free solder with Zn additive / Iziana Yahya
द्वारा: Yahya, Iziana
प्रकाशित: (2016) -
Study Of Wettability And Corrosion Behavior Of Sn-37pb, Sn-8zn-3bi And Sn-3ag-0.5cu Solders
द्वारा: Ridhai, Mohammed Noori
प्रकाशित: (2010) -
Microstructural evaluation of sn3.0ag0.5cu solder alloy fabricated via powder metallurgy method
द्वारा: Nadhrah, Murad
प्रकाशित: (2021) -
Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag 0.5Cu solder alloys bearing Fe and Bi / Mohammad Hossein Mahdavifard
द्वारा: Mohammad Hossein, Mahdavifard
प्रकाशित: (2017)