Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn / Leong Yee Mei

Driven by the recent trend towards miniaturization of lead free electronic products, researchers are putting immense efforts to improve the properties and reliability of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC 105 (Sn-1.0Ag-0.5Cu) solder because...

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Détails bibliographiques
Auteur principal:	Leong , Yee Mei
Format:	Thèse
Publié:	2020
Sujets:	TJ Mechanical engineering and machinery

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