Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn / Leong Yee Mei
Driven by the recent trend towards miniaturization of lead free electronic products, researchers are putting immense efforts to improve the properties and reliability of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC 105 (Sn-1.0Ag-0.5Cu) solder because...
| 主要作者: | Leong , Yee Mei |
|---|---|
| 格式: | Thesis |
| 出版: |
2020
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| 主題: |
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相似書籍
-
Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate
由: Ghani, Fitriah Abdul
出版: (2018) -
Studies on intermetallics and physical properties of Sn-3.5Ag-1.0Cu lead free solder with Zn additive / Iziana Yahya
由: Yahya, Iziana
出版: (2016) -
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由: Ridhai, Mohammed Noori
出版: (2010) -
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出版: (2017)