Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package / Saif Wakeel

The complexity of cleaning caused by miniaturization of electronic packages and the drive towards cost reduction have recently led to the development of no-clean fluxes (NCF). In this study, characterization and effect of two commercial NCF namely NC-1 and NC-2 on the fine pitch flip-chip package we...

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Bibliographic Details
Main Author:	Saif , Wakeel
Format:	Thesis
Published:	2021
Subjects:	TA Engineering (General). Civil engineering (General)

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