Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package / Saif Wakeel
The complexity of cleaning caused by miniaturization of electronic packages and the drive towards cost reduction have recently led to the development of no-clean fluxes (NCF). In this study, characterization and effect of two commercial NCF namely NC-1 and NC-2 on the fine pitch flip-chip package we...
| मुख्य लेखक: | Saif , Wakeel |
|---|---|
| स्वरूप: | थीसिस |
| प्रकाशित: |
2021
|
| विषय: |
समान संसाधन
Solder Joint Reliability Of Flip Chip BGA Package
द्वारा: Lee, Kor Oon
प्रकाशित: (2004)
द्वारा: Lee, Kor Oon
प्रकाशित: (2004)
Mold filling parameters in resin transfer molding for flip chip semiconductor packages
द्वारा: Lim, Ming Siong
प्रकाशित: (2017)
द्वारा: Lim, Ming Siong
प्रकाशित: (2017)
CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing
Methods
द्वारा: Khor , Chu Yee
प्रकाशित: (2010)
द्वारा: Khor , Chu Yee
प्रकाशित: (2010)
Numerical Analysis During Encapsulation Process Of Molded Underfill With Multi Flip Chip Package
द्वारा: Azmi, Muhammad Afiq
प्रकाशित: (2018)
द्वारा: Azmi, Muhammad Afiq
प्रकाशित: (2018)
High Frequency Signaling Analysis
Of Inter-Chip Package Routing
For Multi-Chip Package
द्वारा: Yong, Khang Choong
प्रकाशित: (2013)
द्वारा: Yong, Khang Choong
प्रकाशित: (2013)
Solder paste printing yield improvement for SMT ultra fine pitch product by using six sigma technique
द्वारा: Lim, Kean Teik
प्रकाशित: (2016)
द्वारा: Lim, Kean Teik
प्रकाशित: (2016)
Flip-Chip Bonding Using Laser Induced Ultrasonic Vibration
द्वारा: Nordin, Mohd Hisham
प्रकाशित: (2016)
द्वारा: Nordin, Mohd Hisham
प्रकाशित: (2016)
Numerical study of helical savonius rotor in urban areas / Saif Zeyad Mustafa
द्वारा: Saif , Zeyad Mustafa
प्रकाशित: (2011)
द्वारा: Saif , Zeyad Mustafa
प्रकाशित: (2011)
Modeling and design a pitch controller
द्वारा: Wahid, Nurbaiti
प्रकाशित: (2008)
द्वारा: Wahid, Nurbaiti
प्रकाशित: (2008)
Modeling Of Vertical Side Chip Interconnect Technology For 3-Dimensional Packaging
द्वारा: Tan , Ai Heong
प्रकाशित: (2015)
द्वारा: Tan , Ai Heong
प्रकाशित: (2015)
Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb]
[Microfiche 7607].
द्वारा: Goh, Teck Joo
प्रकाशित: (2004)
द्वारा: Goh, Teck Joo
प्रकाशित: (2004)
Design of A unmanned aerial vehicles assisted search and rescue collaboration architecture for emergency communication systems / Abdu Ahmed Saif Ahmed
द्वारा: Abdu Ahmed , Saif Ahmed
प्रकाशित: (2022)
द्वारा: Abdu Ahmed , Saif Ahmed
प्रकाशित: (2022)
Metrical analyses of the location of the mandibular canal using CBCT / Saif Yousif Abdullah
द्वारा: Abdullah, Saif Yousif
प्रकाशित: (2011)
द्वारा: Abdullah, Saif Yousif
प्रकाशित: (2011)
Variations in the human mandibular canal and foramina: A CBCT study / Saif Yousif Abdullah
द्वारा: Saif Yousif , Abdullah
प्रकाशित: (2017)
द्वारा: Saif Yousif , Abdullah
प्रकाशित: (2017)
Metrical analyses of the location of the
mandibular canal using cbct / Saif Yousif Abdullah (latihan)
द्वारा: Abdullah, Saif Yousif
प्रकाशित: (2012)
द्वारा: Abdullah, Saif Yousif
प्रकाशित: (2012)
Effect of variable helix and pitch tool geometries on process damping performance in endmilling process
द्वारा: Muhammad Adib, Shaharun
प्रकाशित: (2015)
द्वारा: Muhammad Adib, Shaharun
प्रकाशित: (2015)
Glycerine pitch from glycerine concentration process as alternative fuel for boiler operations
द्वारा: Merapan, Kirubaharan
प्रकाशित: (2015)
द्वारा: Merapan, Kirubaharan
प्रकाशित: (2015)
Preparation and characterization of poly (methyl methacrylate) / irradiated - 50% epoxidized natural rubber based solid electrolytes / Zayana Saif
द्वारा: Saif, Zayana
प्रकाशित: (2009)
द्वारा: Saif, Zayana
प्रकाशित: (2009)
Influence of studs shape and different pitch conditions on rugby athlete sprinting performance
द्वारा: Sharul Nizam, Turiman
प्रकाशित: (2023)
द्वारा: Sharul Nizam, Turiman
प्रकाशित: (2023)
Dynamic Time Warping fixed - frame coefficient with pitch feature for speech recognition system with neural network
द्वारा: Sudirman, Rubita
प्रकाशित: (2007)
द्वारा: Sudirman, Rubita
प्रकाशित: (2007)
Studies On Cleaning Efficiency Of Various Natural Rubber Latex Cleaning Compounds
द्वारा: Dzulkafly, Nuur Syuhada
प्रकाशित: (2018)
द्वारा: Dzulkafly, Nuur Syuhada
प्रकाशित: (2018)
Adaptive simplified fuzzy logic controller of unmanned underwater vehicle for depth and pitch control
द्वारा: Seik Heng, Kai
प्रकाशित: (2016)
द्वारा: Seik Heng, Kai
प्रकाशित: (2016)
Web log cleaning algorithm for intrusion detection
द्वारा: Ong, Yew Chuan
प्रकाशित: (2013)
द्वारा: Ong, Yew Chuan
प्रकाशित: (2013)
Developing a framework for English language curriculum evaluation in Oman / Khalid Salim Saif Al-Jardani
द्वारा: Al-Jardani, Khalid Salim Saif
प्रकाशित: (2013)
द्वारा: Al-Jardani, Khalid Salim Saif
प्रकाशित: (2013)
Properties of crushed recycled fine aggregate in concrete mixes
द्वारा: Mohd. Syaifu, Mohd. Murad
प्रकाशित: (2013)
द्वारा: Mohd. Syaifu, Mohd. Murad
प्रकाशित: (2013)
Development of multi-cyclone for fine dust emission control
द्वारा: Hussein, Norelyza
प्रकाशित: (2016)
द्वारा: Hussein, Norelyza
प्रकाशित: (2016)
The use of scrap tyre as fine and coarse aggregate in concrete
द्वारा: Adamu, Musa
प्रकाशित: (2014)
द्वारा: Adamu, Musa
प्रकाशित: (2014)
Pitch Accuracy in the Singing of Secondary School Students
द्वारा: Su, Lih Huey
प्रकाशित: (2008)
द्वारा: Su, Lih Huey
प्रकाशित: (2008)
Network on chip prototyping and emulation
द्वारा: Tay, Huey Fen
प्रकाशित: (2010)
द्वारा: Tay, Huey Fen
प्रकाशित: (2010)
Efficiency optimization of an induction machine using constant optimal flux control
द्वारा: Sidek, Nor Khairunnisa
प्रकाशित: (2015)
द्वारा: Sidek, Nor Khairunnisa
प्रकाशित: (2015)
Utilization of coconut shell as fine aggregate in asphaltic concrete AC14
द्वारा: Miron, Nurfatin Aqeela
प्रकाशित: (2015)
द्वारा: Miron, Nurfatin Aqeela
प्रकाशित: (2015)
Effect of fines content and plasticity on liquefaction susceptibility of sand matrix soils
द्वारा: Tan, Choy Soon
प्रकाशित: (2015)
द्वारा: Tan, Choy Soon
प्रकाशित: (2015)
Effect of fineness coconut shell charcoal ash on the rheological properties of bitumen
द्वारा: Mad. Rosni, Nurul Najihah
प्रकाशित: (2016)
द्वारा: Mad. Rosni, Nurul Najihah
प्रकाशित: (2016)
Electromagnetic flux modelling of AC field over planar microarray dot electrodes used in rapid dielectrophoretic lab-on-chip device / Aizreena Azaman
द्वारा: Aizreena , Azaman
प्रकाशित: (2012)
द्वारा: Aizreena , Azaman
प्रकाशित: (2012)
Development of ironless coreless axial flux permanent magnet generator
द्वारा: Yap, Wee Leong
प्रकाशित: (2016)
द्वारा: Yap, Wee Leong
प्रकाशित: (2016)
Electrostatic Discharge For Sysyem On Chip Applications
द्वारा: Yuet, Cheryl She Siew
प्रकाशित: (2017)
द्वारा: Yuet, Cheryl She Siew
प्रकाशित: (2017)
Network-on-chip network adapter
द्वारा: Sha’ari, Mohd. Farhan
प्रकाशित: (2009)
द्वारा: Sha’ari, Mohd. Farhan
प्रकाशित: (2009)
Network-on-chip non-preemptive test scheduling
द्वारा: Mispan, Mohd. Syafiq
प्रकाशित: (2010)
द्वारा: Mispan, Mohd. Syafiq
प्रकाशित: (2010)
AMBA AXI bus to network-on-chip bridge
द्वारा: Ng, Keng Yoke
प्रकाशित: (2013)
द्वारा: Ng, Keng Yoke
प्रकाशित: (2013)
Effect of aggregate moisture on adhesion of chip seal
द्वारा: Che Ajid, Nur Hizaruddin
प्रकाशित: (2012)
द्वारा: Che Ajid, Nur Hizaruddin
प्रकाशित: (2012)
समान संसाधन
-
Solder Joint Reliability Of Flip Chip BGA Package
द्वारा: Lee, Kor Oon
प्रकाशित: (2004) -
Mold filling parameters in resin transfer molding for flip chip semiconductor packages
द्वारा: Lim, Ming Siong
प्रकाशित: (2017) -
CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing
Methods
द्वारा: Khor , Chu Yee
प्रकाशित: (2010) -
Numerical Analysis During Encapsulation Process Of Molded Underfill With Multi Flip Chip Package
द्वारा: Azmi, Muhammad Afiq
प्रकाशित: (2018) -
High Frequency Signaling Analysis
Of Inter-Chip Package Routing
For Multi-Chip Package
द्वारा: Yong, Khang Choong
प्रकाशित: (2013)