Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package / Saif Wakeel
The complexity of cleaning caused by miniaturization of electronic packages and the drive towards cost reduction have recently led to the development of no-clean fluxes (NCF). In this study, characterization and effect of two commercial NCF namely NC-1 and NC-2 on the fine pitch flip-chip package we...
| 第一著者: | Saif , Wakeel |
|---|---|
| フォーマット: | 学位論文 |
| 出版事項: |
2021
|
| 主題: |
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類似資料
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