Effect of heating on bonding characteristics for copper wire bond technology / Gurbinder Singh
In recent years, copper has increasingly been used to replace gold to create wire interconnections in microelectronics. While the industry is continuously working on this transition from gold to copper wire to reduce costs, the challenge remain in producing robust and reliable joints for semiconduct...
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| フォーマット: | 学位論文 |
| 出版事項: |
2021
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