Characterization of Sn-Bi-Co low temperature solder alloy / Lina Syazwana Kamaruzzaman
Sn-Bi solder had Bi-rich phase that brittle and prone to fracture during service. As the result, the excessive hardness and brittleness of Sn-Bi solder alloy could easily deteriorate the solder mechanical properties which then strongly influence the solder joint and packaging components continuing r...
| 主要作者: | Lina Syazwana , Kamaruzzaman |
|---|---|
| 格式: | Thesis |
| 出版: |
2023
|
| 主题: |
相似书籍
Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
由: Hashim, Md. Amin
出版: (2011)
由: Hashim, Md. Amin
出版: (2011)
Morphological and mechanical characterisation of BI-AG alloy as high temperature lead free solder
由: Nahavandi, Mahdi
出版: (2014)
由: Nahavandi, Mahdi
出版: (2014)
Characterization Of Indium Based Low Temperature Solder Alloy And The Effect On Surface Finish
由: Mhd Noor, Ervina Efzan
出版: (2013)
由: Mhd Noor, Ervina Efzan
出版: (2013)
Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization
由: Mayappan, Ramani
出版: (2007)
由: Mayappan, Ramani
出版: (2007)
Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag 0.5Cu solder alloys bearing Fe and Bi / Mohammad Hossein Mahdavifard
由: Mohammad Hossein, Mahdavifard
出版: (2017)
由: Mohammad Hossein, Mahdavifard
出版: (2017)
Study Of Wettability And Corrosion Behavior Of Sn-37pb, Sn-8zn-3bi And Sn-3ag-0.5cu Solders
由: Ridhai, Mohammed Noori
出版: (2010)
由: Ridhai, Mohammed Noori
出版: (2010)
Investigations On The Properties Of Sn-8zn-3Bi Lead-Free And Sn-37Pb Eutectic Solder Alloys [TS610. D928 2005 f rb] [Microfiche 8175].
由: Duong, Ngoc Binh
出版: (2005)
由: Duong, Ngoc Binh
出版: (2005)
Electrodeposition and characterization of SN-BI lead-free soldier alloys / Goh YingXin
由: Goh, Ying Xin
出版: (2015)
由: Goh, Ying Xin
出版: (2015)
Evaluation of electrical properties, oxidation and corrosion behavior of Fe and Bi added Sn-0.7 Cu lead-free solder alloy / Syed Hassan Abbas Jaffery
由: Syed Hassan , Abbas Jaffery
出版: (2017)
由: Syed Hassan , Abbas Jaffery
出版: (2017)
Microstructural characteristics and mechanical performance of Bi-Sb-Ni added Sn 3.0Ag-0.5Cu multicomponent lead-free solder alloy / Zhou Ding
由: Zhou , Ding
出版: (2024)
由: Zhou , Ding
出版: (2024)
Bearing capacity of interbedded weak sedimentary rock / Kamaruzzaman Mohamed
由: Mohamed, Kamaruzzaman
出版: (2010)
由: Mohamed, Kamaruzzaman
出版: (2010)
Molecular analysis and characterization of genes involved in glycogen storage disease type III and selected inherited metabolic disorders / Ili Syazwana Abdullah
由: Ili Syazwana , Abdullah
出版: (2019)
由: Ili Syazwana , Abdullah
出版: (2019)
Effect of nickel doping into solder alloy and its strength between SnCu-Ni/immersion gold joint
由: Zetty Akhtar, Abd Malek
出版: (2017)
由: Zetty Akhtar, Abd Malek
出版: (2017)
Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].
由: Mayappan, Ramani
出版: (2007)
由: Mayappan, Ramani
出版: (2007)
Bismuth-argentum alloys as alternative high temperature lead-free solder
由: Rosilli, Rohaizuan
出版: (2012)
由: Rosilli, Rohaizuan
出版: (2012)
Isothermal Aging Of Sn-3.0ag-0.5cu And Sn100c Solder Alloys Processed Via Equal Channel Angular Pressing
由: Baser, Muhammad Fadlin Hazim
出版: (2020)
由: Baser, Muhammad Fadlin Hazim
出版: (2020)
Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
由: Tai, Siew Fong
出版: (2003)
由: Tai, Siew Fong
出版: (2003)
Evaluation of water table influence to slop stability / Muhamad Syafien Kamaruzzaman
由: Kamaruzzaman, Muhamad Syafien
出版: (2019)
由: Kamaruzzaman, Muhamad Syafien
出版: (2019)
Microstructural evaluation of sn3.0ag0.5cu solder alloy fabricated via powder metallurgy method
由: Nadhrah, Murad
出版: (2021)
由: Nadhrah, Murad
出版: (2021)
Critical discourse analysis of advertisements in Malaysian women's magazine / Atiqah Zawani binti Kamaruzzaman.
由: Kamaruzzaman, Atiqah Zawani
出版: (2010)
由: Kamaruzzaman, Atiqah Zawani
出版: (2010)
Board of director's characteristics and the likelihood of corporate fraud: Malaysian case / Airul Aezza Kamaruzzaman
由: Kamaruzzaman, Airul Aezza
出版: (2013)
由: Kamaruzzaman, Airul Aezza
出版: (2013)
Product management system for Syaheer Rezali Cosmetic / Nur Athirah Mohd Kamaruzzaman
由: Mohd Kamaruzzaman, Nur Athirah
出版: (2017)
由: Mohd Kamaruzzaman, Nur Athirah
出版: (2017)
Harmonisation of accounting information system in a new environment for a Malaysian agricultural company / Kamaruzzaman Muhammad
由: Muhammad, Kamaruzzaman
出版: (2018)
由: Muhammad, Kamaruzzaman
出版: (2018)
Separation and identification of chemicals compound obtained from selected bio oil / Airin Aezzira Kamaruzzaman
由: Kamaruzzaman, Airin Aezzira
出版: (2016)
由: Kamaruzzaman, Airin Aezzira
出版: (2016)
Study on intermetallic compound formation and growth at the solder joint interface during laser soldering using sn-ag-cu powdered compact solder on copper pad
由: Nabila, Tamar Jaya
出版: (2024)
由: Nabila, Tamar Jaya
出版: (2024)
Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application
由: Bakir, Mohammed Luay
出版: (2012)
由: Bakir, Mohammed Luay
出版: (2012)
The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating
由: Maliessa Nabilah, Mazelan
出版: (2023)
由: Maliessa Nabilah, Mazelan
出版: (2023)
Determinants of corporate share buybacks : the Malaysian experience / Nura Lina binti Md Elias
由: Md Elias, Nura Lina
出版: (2010)
由: Md Elias, Nura Lina
出版: (2010)
Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish
由: Osman, Saliza Azlina
出版: (2008)
由: Osman, Saliza Azlina
出版: (2008)
Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process
由: Chellvarajoo, Srivalli
出版: (2016)
由: Chellvarajoo, Srivalli
出版: (2016)
Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process
由: Chellvarajoo, Srivalli
出版: (2016)
由: Chellvarajoo, Srivalli
出版: (2016)
Tactile sensing fingers device using quantum tunneling composite (QTC) pills / Nurizzah Lina Azaman
由: Azaman, Nurizzah Lina
出版: (2018)
由: Azaman, Nurizzah Lina
出版: (2018)
The effects of using familiar melodies in melodic interval identification in undergraduate music majors / Nur Lina Anuar
由: Nur Lina, Anuar
出版: (2015)
由: Nur Lina, Anuar
出版: (2015)
Effect Of Al Addition To Imc Formation, Mechanical And Wetting Properties Of Low-Ag Sac Solder Alloy
由: Kamarudin, Maslina
出版: (2015)
由: Kamarudin, Maslina
出版: (2015)
Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes
由: Abu Hassan, Nurfazlin
出版: (2009)
由: Abu Hassan, Nurfazlin
出版: (2009)
Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
由: Idris, Siti Rabiatull Aisha
出版: (2008)
由: Idris, Siti Rabiatull Aisha
出版: (2008)
Role of Nigella sativa oil on histological features and androgenicity of nicotine treated male Sprague dawley reproductive system / Lina binti Samsudin
由: Samsudin, Lina
出版: (2015)
由: Samsudin, Lina
出版: (2015)
Intermetallics evolution and shear strength of carbon nanotubes- reinforced sn-5sb solder on copper board
由: Dele-Afolabi, Temitope Theophilus
出版: (2015)
由: Dele-Afolabi, Temitope Theophilus
出版: (2015)
Effect Of Indium Addition On Microstructure, Wettability, Shear Strength And Creep Behavior Of Sn100c Solder
由: Abdullah, Nabihah
出版: (2019)
由: Abdullah, Nabihah
出版: (2019)
Effect of indium addition on microstructure, wettability, shear strength and creep behavior of sn100c solder
由: Abdullah, Nabihah
出版: (2019)
由: Abdullah, Nabihah
出版: (2019)
相似书籍
-
Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
由: Hashim, Md. Amin
出版: (2011) -
Morphological and mechanical characterisation of BI-AG alloy as high temperature lead free solder
由: Nahavandi, Mahdi
出版: (2014) -
Characterization Of Indium Based Low Temperature Solder Alloy And The Effect On Surface Finish
由: Mhd Noor, Ervina Efzan
出版: (2013) -
Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization
由: Mayappan, Ramani
出版: (2007) -
Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag 0.5Cu solder alloys bearing Fe and Bi / Mohammad Hossein Mahdavifard
由: Mohammad Hossein, Mahdavifard
出版: (2017)