Ng , Q. Q. (2024). Curing profile optimization of silver epoxy die attach in ball grid array package process / Ng Qian Qing.
शिकागो शैली (17वां संस्करण) प्रशस्ति पत्रNg , Qian Qing. Curing Profile Optimization of Silver Epoxy Die Attach in Ball Grid Array Package Process / Ng Qian Qing. 2024.
एमएलए (9वां संस्करण) प्रशस्ति पत्रNg , Qian Qing. Curing Profile Optimization of Silver Epoxy Die Attach in Ball Grid Array Package Process / Ng Qian Qing. 2024.
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