APA (7th ed.) Citation

Ng , Q. Q. (2024). Curing profile optimization of silver epoxy die attach in ball grid array package process / Ng Qian Qing.

Chicago Style (17th ed.) Citation

Ng , Qian Qing. Curing Profile Optimization of Silver Epoxy Die Attach in Ball Grid Array Package Process / Ng Qian Qing. 2024.

MLA (9th ed.) Citation

Ng , Qian Qing. Curing Profile Optimization of Silver Epoxy Die Attach in Ball Grid Array Package Process / Ng Qian Qing. 2024.

Warning: These citations may not always be 100% accurate.