Ng , Q. Q. (2024). Curing profile optimization of silver epoxy die attach in ball grid array package process / Ng Qian Qing.
芝加哥风格引文Ng , Qian Qing. Curing Profile Optimization of Silver Epoxy Die Attach in Ball Grid Array Package Process / Ng Qian Qing. 2024.
MLA引文Ng , Qian Qing. Curing Profile Optimization of Silver Epoxy Die Attach in Ball Grid Array Package Process / Ng Qian Qing. 2024.
警告：这些引文格式不一定是100％准确.