Curing profile optimization of silver epoxy die attach in ball grid array package process / Ng Qian Qing
Ball grid array (BGA) packages are essential components in automotive applications, renowned for their compact form factor and high-density interconnections. However, the persistent issue of void formation within these packages poses a significant challenge to their performance and reliability. This...
| मुख्य लेखक: | Ng , Qian Qing |
|---|---|
| स्वरूप: | थीसिस |
| प्रकाशित: |
2024
|
| विषय: |
समान संसाधन
Microstructural characterization of pressureless sintered silver die attached material
द्वारा: Esa, Siti Rahmah
प्रकाशित: (2022)
द्वारा: Esa, Siti Rahmah
प्रकाशित: (2022)
Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging / Low Pui Leng
द्वारा: Low, Pui Leng
प्रकाशित: (2019)
द्वारा: Low, Pui Leng
प्रकाशित: (2019)
Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface
द्वारा: Yeo, Kian Hong
प्रकाशित: (2016)
द्वारा: Yeo, Kian Hong
प्रकाशित: (2016)
Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages
द्वारा: Lim, Chong Hooi
प्रकाशित: (2017)
द्वारा: Lim, Chong Hooi
प्रकाशित: (2017)
Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications
द्वारा: Tan , Kim Seah
प्रकाशित: (2015)
द्वारा: Tan , Kim Seah
प्रकाशित: (2015)
Investigations On Silver-Copper
Nanopaste As Die-Attach Material For
High Temperature Applications
द्वारा: Tan , Kim Seah
प्रकाशित: (2015)
द्वारा: Tan , Kim Seah
प्रकाशित: (2015)
Lipid nanoparticles in thermoresponsive gel for topical application / Lim Qian Ying
द्वारा: Lim , Qian Ying
प्रकाशित: (2017)
द्वारा: Lim , Qian Ying
प्रकाशित: (2017)
Studies on the growth, structural and electrical properties of silicon-based heterostructure nanowires
/ Qian Guanghan
द्वारा: Qian, Guanghan
प्रकाशित: (2015)
द्वारा: Qian, Guanghan
प्रकाशित: (2015)
Optimization of silver nanoparticles sizes in ag-cu nanopaste as die-attach materials for high temperature applications
द्वारा: Noordin, Norasiah Mohammad
प्रकाशित: (2017)
द्वारा: Noordin, Norasiah Mohammad
प्रकाशित: (2017)
Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor / Erik Nino Tolentino
द्वारा: Erik Nino, Tolentino
प्रकाशित: (2020)
द्वारा: Erik Nino, Tolentino
प्रकाशित: (2020)
Preventive maintenance improvement at epoxy cure operation
द्वारा: Harudin , Nolia
प्रकाशित: (2010)
द्वारा: Harudin , Nolia
प्रकाशित: (2010)
The impacts of cultural background on project communication management in international construction projects / He Qing
द्वारा: He, Qing
प्रकाशित: (2022)
द्वारा: He, Qing
प्रकाशित: (2022)
Communication strategies used by Chinese students in spoken English / Liu Qing Hua.
द्वारा: Liu, Qing Hua
प्रकाशित: (2010)
द्वारा: Liu, Qing Hua
प्रकाशित: (2010)
A genre-based analysis of hotel advertisements in Malaysia / Li Yong Qing
द्वारा: Li, Yong Qing
प्रकाशित: (2013)
द्वारा: Li, Yong Qing
प्रकाशित: (2013)
Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman.
द्वारा: Bustaman, Tengku Elisa
प्रकाशित: (1999)
द्वारा: Bustaman, Tengku Elisa
प्रकाशित: (1999)
Communication strategies used by Chinese students from China in spoken English / Liu Qing Hua
द्वारा: Liu, Qing Hua
प्रकाशित: (2010)
द्वारा: Liu, Qing Hua
प्रकाशित: (2010)
Effects of curing angle on laminated unsaturated polyster epoxy composites structures
द्वारा: Tan, Teng Teng
प्रकाशित: (2015)
द्वारा: Tan, Teng Teng
प्रकाशित: (2015)
Fabrication And Characterization Of Ag-Al Die Attach Material For Sic-Based High Temperature Device
द्वारा: Vemal , Raja Manikam
प्रकाशित: (2012)
द्वारा: Vemal , Raja Manikam
प्रकाशित: (2012)
Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
द्वारा: Law, Ruen Ching
प्रकाशित: (2012)
द्वारा: Law, Ruen Ching
प्रकाशित: (2012)
Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe
द्वारा: Siah, Meng Zhe
प्रकाशित: (2019)
द्वारा: Siah, Meng Zhe
प्रकाशित: (2019)
Study of copper-aluminium high temperature die-attach material with different aluminium weight percentage /Shiu Kai Ping
द्वारा: Shiu , Kai Ping
प्रकाशित: (2017)
द्वारा: Shiu , Kai Ping
प्रकाशित: (2017)
Synthesis and characterization of silver nanoparticles filled epoxy composite
द्वारा: Nurul Akma, Reduan
प्रकाशित: (2018)
द्वारा: Nurul Akma, Reduan
प्रकाशित: (2018)
Optimisation of transverse arc array laser / Ng, Albert Kok Foo
द्वारा: Ng, Albert Kok Foo
प्रकाशित: (2000)
द्वारा: Ng, Albert Kok Foo
प्रकाशित: (2000)
Disenchantment narrative in anti-superstition fiction of the late Qing dynasty
द्वारा: Ding, Sing Jek
प्रकाशित: (2015)
द्वारा: Ding, Sing Jek
प्रकाशित: (2015)
Properties Of Silver-Filled Epoxy Composites For Electronic Application Using Synthesized And Commercial Silver Nanoparticles
द्वारा: Ghazali, Suriati
प्रकाशित: (2012)
द्वारा: Ghazali, Suriati
प्रकाशित: (2012)
Millimeter-wave grid array antenna for 5G mobile communication networks
द्वारा: Mustafa, Abu Bakr Mohamed Ali
प्रकाशित: (2015)
द्वारा: Mustafa, Abu Bakr Mohamed Ali
प्रकाशित: (2015)
Study Of Processing Parameters In Manufacturing Of Flat Glass-Epoxy Composite Laminates Using Vacuum Bagging Oven Curing
द्वारा: Hanafiah, Nur Hafzareen Md
प्रकाशित: (2013)
द्वारा: Hanafiah, Nur Hafzareen Md
प्रकाशित: (2013)
Mechanical properties and morphology of UV-cured glass fiber/epoxy acrylates composite / Mohamad Hafiz Mohd. Wahid
द्वारा: Mohd. Wahid, Mohamad Hafiz
प्रकाशित: (2009)
द्वारा: Mohd. Wahid, Mohamad Hafiz
प्रकाशित: (2009)
Properties Of Silver Filled Epoxy Composites For Electrical Conductive Adhesive Applications
द्वारा: Shariff, Khairul Anuar
प्रकाशित: (2011)
द्वारा: Shariff, Khairul Anuar
प्रकाशित: (2011)
Pembentukan novel Niehai Hua dalam konteks masyarakat pada akhir dinasti Qing
द्वारा: Wong Soon Dee
प्रकाशित: (2018)
द्वारा: Wong Soon Dee
प्रकाशित: (2018)
Improving die exchange process in textile manufacturing company with single minute exchange of die (SMED)
द्वारा: Arzmi, Muhammad Hazwan
प्रकाशित: (2014)
द्वारा: Arzmi, Muhammad Hazwan
प्रकाशित: (2014)
Changeover time improvement of pressure die casting machine by single minute exchange of die implementation
द्वारा: Embok Resa, Mohammad Afif
प्रकाशित: (2020)
द्वारा: Embok Resa, Mohammad Afif
प्रकाशित: (2020)
Wuxu Zhengbian Ji dan kemunculan penulisan sastera laporan Cina pada penghujung Dinasti Qing
द्वारा: Tan, Yong Ling
प्रकाशित: (2019)
द्वारा: Tan, Yong Ling
प्रकाशित: (2019)
Development Of A New Class Of Liquid Crystalline Epoxy Resins Cured By Mesogenic Diols [TP1180.E6 F144 2008 f rb].
द्वारा: Ali, Mohd Fadhley
प्रकाशित: (2008)
द्वारा: Ali, Mohd Fadhley
प्रकाशित: (2008)
Optimizing the changeover of packaging machine by implementing single minute exchange of dies in textile manufacturing industry
द्वारा: Rosli, Mohamad Muzammir
प्रकाशित: (2016)
द्वारा: Rosli, Mohamad Muzammir
प्रकाशित: (2016)
Robotic ball balancing beam(RBBB)
द्वारा: Namazi, Soheil
प्रकाशित: (2011)
द्वारा: Namazi, Soheil
प्रकाशित: (2011)
Characteristic on electromagnetic energy harvesting using graphene/silver filled epoxy for PVT thermal hybrid solar collector
द्वारा: Naroh, Azmi
प्रकाशित: (2019)
द्वारा: Naroh, Azmi
प्रकाशित: (2019)
Die defect classification using image processing
द्वारा: Maniam, Darmadevaindra
प्रकाशित: (2015)
द्वारा: Maniam, Darmadevaindra
प्रकाशित: (2015)
Ball and beam balancer control using microcontroller
द्वारा: Ismail, Nadiah
प्रकाशित: (2009)
द्वारा: Ismail, Nadiah
प्रकाशित: (2009)
The study on the micro-pits location on the extrusion die surface
द्वारा: Ahmad, Norhayati
प्रकाशित: (2010)
द्वारा: Ahmad, Norhayati
प्रकाशित: (2010)
समान संसाधन
-
Microstructural characterization of pressureless sintered silver die attached material
द्वारा: Esa, Siti Rahmah
प्रकाशित: (2022) -
Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging / Low Pui Leng
द्वारा: Low, Pui Leng
प्रकाशित: (2019) -
Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface
द्वारा: Yeo, Kian Hong
प्रकाशित: (2016) -
Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages
द्वारा: Lim, Chong Hooi
प्रकाशित: (2017) -
Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications
द्वारा: Tan , Kim Seah
प्रकाशित: (2015)