Curing profile optimization of silver epoxy die attach in ball grid array package process / Ng Qian Qing

Ball grid array (BGA) packages are essential components in automotive applications, renowned for their compact form factor and high-density interconnections. However, the persistent issue of void formation within these packages poses a significant challenge to their performance and reliability. This...

وصف كامل

التفاصيل البيبلوغرافية
المؤلف الرئيسي:	Ng , Qian Qing
التنسيق:	أطروحة
منشور في:	2024
الموضوعات:	TJ Mechanical engineering and machinery

مواد مشابهة

Microstructural characterization of pressureless sintered silver die attached material
حسب: Esa, Siti Rahmah
منشور في: (2022)

Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging / Low Pui Leng
حسب: Low, Pui Leng
منشور في: (2019)

Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface
حسب: Yeo, Kian Hong
منشور في: (2016)

Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages
حسب: Lim, Chong Hooi
منشور في: (2017)

Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications
حسب: Tan , Kim Seah
منشور في: (2015)

Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications
حسب: Tan , Kim Seah
منشور في: (2015)

Lipid nanoparticles in thermoresponsive gel for topical application / Lim Qian Ying
حسب: Lim , Qian Ying
منشور في: (2017)

Studies on the growth, structural and electrical properties of silicon-based heterostructure nanowires / Qian Guanghan
حسب: Qian, Guanghan
منشور في: (2015)

Optimization of silver nanoparticles sizes in ag-cu nanopaste as die-attach materials for high temperature applications
حسب: Noordin, Norasiah Mohammad
منشور في: (2017)

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حسب: Erik Nino, Tolentino
منشور في: (2020)

Preventive maintenance improvement at epoxy cure operation
حسب: Harudin , Nolia
منشور في: (2010)

The impacts of cultural background on project communication management in international construction projects / He Qing
حسب: He, Qing
منشور في: (2022)

Communication strategies used by Chinese students in spoken English / Liu Qing Hua.
حسب: Liu, Qing Hua
منشور في: (2010)

A genre-based analysis of hotel advertisements in Malaysia / Li Yong Qing
حسب: Li, Yong Qing
منشور في: (2013)

Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman.
حسب: Bustaman, Tengku Elisa
منشور في: (1999)

Communication strategies used by Chinese students from China in spoken English / Liu Qing Hua
حسب: Liu, Qing Hua
منشور في: (2010)

Effects of curing angle on laminated unsaturated polyster epoxy composites structures
حسب: Tan, Teng Teng
منشور في: (2015)

Fabrication And Characterization Of Ag-Al Die Attach Material For Sic-Based High Temperature Device
حسب: Vemal , Raja Manikam
منشور في: (2012)

Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
حسب: Law, Ruen Ching
منشور في: (2012)

Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe
حسب: Siah, Meng Zhe
منشور في: (2019)

Study of copper-aluminium high temperature die-attach material with different aluminium weight percentage /Shiu Kai Ping
حسب: Shiu , Kai Ping
منشور في: (2017)

Synthesis and characterization of silver nanoparticles filled epoxy composite
حسب: Nurul Akma, Reduan
منشور في: (2018)

Optimisation of transverse arc array laser / Ng, Albert Kok Foo
حسب: Ng, Albert Kok Foo
منشور في: (2000)

Disenchantment narrative in anti-superstition fiction of the late Qing dynasty
حسب: Ding, Sing Jek
منشور في: (2015)

Properties Of Silver-Filled Epoxy Composites For Electronic Application Using Synthesized And Commercial Silver Nanoparticles
حسب: Ghazali, Suriati
منشور في: (2012)

Millimeter-wave grid array antenna for 5G mobile communication networks
حسب: Mustafa, Abu Bakr Mohamed Ali
منشور في: (2015)

Study Of Processing Parameters In Manufacturing Of Flat Glass-Epoxy Composite Laminates Using Vacuum Bagging Oven Curing
حسب: Hanafiah, Nur Hafzareen Md
منشور في: (2013)

Mechanical properties and morphology of UV-cured glass fiber/epoxy acrylates composite / Mohamad Hafiz Mohd. Wahid
حسب: Mohd. Wahid, Mohamad Hafiz
منشور في: (2009)

Properties Of Silver Filled Epoxy Composites For Electrical Conductive Adhesive Applications
حسب: Shariff, Khairul Anuar
منشور في: (2011)

Pembentukan novel Niehai Hua dalam konteks masyarakat pada akhir dinasti Qing
حسب: Wong Soon Dee
منشور في: (2018)

Improving die exchange process in textile manufacturing company with single minute exchange of die (SMED)
حسب: Arzmi, Muhammad Hazwan
منشور في: (2014)

Changeover time improvement of pressure die casting machine by single minute exchange of die implementation
حسب: Embok Resa, Mohammad Afif
منشور في: (2020)

Wuxu Zhengbian Ji dan kemunculan penulisan sastera laporan Cina pada penghujung Dinasti Qing
حسب: Tan, Yong Ling
منشور في: (2019)

Development Of A New Class Of Liquid Crystalline Epoxy Resins Cured By Mesogenic Diols [TP1180.E6 F144 2008 f rb].
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منشور في: (2008)

Optimizing the changeover of packaging machine by implementing single minute exchange of dies in textile manufacturing industry
حسب: Rosli, Mohamad Muzammir
منشور في: (2016)

Robotic ball balancing beam(RBBB)
حسب: Namazi, Soheil
منشور في: (2011)

Characteristic on electromagnetic energy harvesting using graphene/silver filled epoxy for PVT thermal hybrid solar collector
حسب: Naroh, Azmi
منشور في: (2019)

Die defect classification using image processing
حسب: Maniam, Darmadevaindra
منشور في: (2015)

Ball and beam balancer control using microcontroller
حسب: Ismail, Nadiah
منشور في: (2009)

The study on the micro-pits location on the extrusion die surface
حسب: Ahmad, Norhayati
منشور في: (2010)