Curing profile optimization of silver epoxy die attach in ball grid array package process / Ng Qian Qing

Ball grid array (BGA) packages are essential components in automotive applications, renowned for their compact form factor and high-density interconnections. However, the persistent issue of void formation within these packages poses a significant challenge to their performance and reliability. This...

書誌詳細
第一著者:	Ng , Qian Qing
フォーマット:	学位論文
出版事項:	2024
主題:	TJ Mechanical engineering and machinery

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